BGAP2D20AE6327XTSA1 Infineon Pre-Driver for Wireless Infrastructure Applications 35.1 dB, 16-Pin 2700MHz TSNP-16
- RS Stock No.:
- 349-416
- Mfr. Part No.:
- BGAP2D20AE6327XTSA1
- Brand:
- Infineon
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- RS Stock No.:
- 349-416
- Mfr. Part No.:
- BGAP2D20AE6327XTSA1
- Brand:
- Infineon
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Infineon | |
| Product Type | Pre-Driver for Wireless Infrastructure Applications | |
| Technology | BiCMOS | |
| Gain | 35.1dB | |
| Package Type | TSNP-16 | |
| Minimum Supply Voltage | 4.75V | |
| Pin Count | 16 | |
| Maximum Supply Voltage | 5.5V | |
| Third Order Intercept OIP3 | 34.3dBm | |
| Minimum Operating Temperature | -40°C | |
| Noise Figure | 4.7dB | |
| Maximum Operating Temperature | 115°C | |
| Standards/Approvals | RoHS, JEDEC47/20/22 | |
| Height | 8mm | |
| Automotive Standard | No | |
| Select all | ||
|---|---|---|
Brand Infineon | ||
Product Type Pre-Driver for Wireless Infrastructure Applications | ||
Technology BiCMOS | ||
Gain 35.1dB | ||
Package Type TSNP-16 | ||
Minimum Supply Voltage 4.75V | ||
Pin Count 16 | ||
Maximum Supply Voltage 5.5V | ||
Third Order Intercept OIP3 34.3dBm | ||
Minimum Operating Temperature -40°C | ||
Noise Figure 4.7dB | ||
Maximum Operating Temperature 115°C | ||
Standards/Approvals RoHS, JEDEC47/20/22 | ||
Height 8mm | ||
Automotive Standard No | ||
- COO (Country of Origin):
- MY
The Infineon 2.3 to 2.7 GHz low band driver amplifier that can be used as pre driver or driver in RF applications from massive MIMO 5G base stations to small cells and access points. The driver amplifier is typically placed between transceiver IC and power amplifier but can also be used as power amplifier for low power applications. The input is 100Ω differential, the output is 50Ω single ended.
100Ω differential input
5V supply voltage
TSNP 16 leadless package
BiCMOS Technology
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