CTS, 74X 4.7kΩ ±5% Bussed Resistor Array, 8 Resistors, 0.063W total, 6431, Concave
- RS Stock No.:
- 179-0290
- Mfr. Part No.:
- 745C101472JP
- Brand:
- CTS
Subtotal (1 reel of 4000 units)*
£308.00
(exc. VAT)
£368.00
(inc. VAT)
Stock information currently inaccessible
Units | Per unit | Per Reel* |
|---|---|---|
| 4000 + | £0.077 | £308.00 |
*price indicative
- RS Stock No.:
- 179-0290
- Mfr. Part No.:
- 745C101472JP
- Brand:
- CTS
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | CTS | |
| Resistance | 4.7kΩ | |
| Resistor Type | Array | |
| Number of Resistors | 8 | |
| Package/Case | 6431 | |
| Power Rating | 0.063W | |
| Termination Style | Concave | |
| Tolerance | ±5% | |
| Case Style | Moulded | |
| Power Rating per Resistor | 0.063W | |
| Circuit Designator | BUS | |
| Length | 6.4mm | |
| Depth | 3.2mm | |
| Height | 0.7mm | |
| Dimensions | 6.4 x 3.2 x 0.7mm | |
| Series | 74X | |
| Number of Terminals | 10 | |
| Minimum Operating Temperature | -55°C | |
| Temperature Coefficient | ±200ppm/°C | |
| Maximum Operating Temperature | +125°C | |
Select all | ||
|---|---|---|
Brand CTS | ||
Resistance 4.7kΩ | ||
Resistor Type Array | ||
Number of Resistors 8 | ||
Package/Case 6431 | ||
Power Rating 0.063W | ||
Termination Style Concave | ||
Tolerance ±5% | ||
Case Style Moulded | ||
Power Rating per Resistor 0.063W | ||
Circuit Designator BUS | ||
Length 6.4mm | ||
Depth 3.2mm | ||
Height 0.7mm | ||
Dimensions 6.4 x 3.2 x 0.7mm | ||
Series 74X | ||
Number of Terminals 10 | ||
Minimum Operating Temperature -55°C | ||
Temperature Coefficient ±200ppm/°C | ||
Maximum Operating Temperature +125°C | ||
- COO (Country of Origin):
- JP
74x Series Chip Arrays are single packaged devices containing an array of homogeneous resistor elements. Arrays are typically used for convenience when several resistors occupy the same area in a layout. Multiple package sizes and circuit configurations help save placement costs by reducing application component count.
Low Cost Thick Film Technology
Leadless Surface Mount Construction
Concave or Convex Terminations
Solder Coated Nickel Barrier Pads
Isolated and Bussed Circuit Configurations
Improved TCR Tracking vs. Discrete Resistors
Fewer Placements Than Discrete Components
Tape and Reel Packaging
Applications:
Data Communications
Image Processing
Medical Equipment
Networking
Pull-Up/Pull-Down Logic Gates
DDR SDRAM, MDDR, DRAM
Portable Test Equipment
Low Profile High Density Designs
Leadless Surface Mount Construction
Concave or Convex Terminations
Solder Coated Nickel Barrier Pads
Isolated and Bussed Circuit Configurations
Improved TCR Tracking vs. Discrete Resistors
Fewer Placements Than Discrete Components
Tape and Reel Packaging
Applications:
Data Communications
Image Processing
Medical Equipment
Networking
Pull-Up/Pull-Down Logic Gates
DDR SDRAM, MDDR, DRAM
Portable Test Equipment
Low Profile High Density Designs