The potting and encapsulating compound is a two-part resin with excellent water resistance properties, making it versatile and durable for a wide range of applications where moisture ingress may be a concern.

Excellent adhesion to a wide variety of substrates for versatile use
Low viscosity aids quick and efficient potting processes
Excellent resistance to acids, alkalis, and other aqueous materials, ideal for harsh environments
Durable with a high degree of toughness for good physical protection
RoHS-2 Compliant with approvals from UL
Temperature range from -50 to +125°C with quick cure times
Thermal conductivity of 0.245 W/m.K and volume resistivity of 10 ohm-cm
Dielectric strength of 25 kV/mm and tear strength of 52 kN/m for reliable performance