Vishay High Side 1, Load Switch Power Switch IC 10-Pin, DFN-10
- RS Stock No.:
- 240-5288
- Mfr. Part No.:
- SIP32434BDN-T1E4
- Brand:
- Vishay
Subtotal (1 reel of 3000 units)*
£1,578.00
(exc. VAT)
£1,893.00
(inc. VAT)
FREE delivery for orders over £60.00
Last RS stock
- Final 3,000 unit(s), ready to ship
Units | Per unit | Per Reel* |
|---|---|---|
| 3000 + | £0.526 | £1,578.00 |
*price indicative
- RS Stock No.:
- 240-5288
- Mfr. Part No.:
- SIP32434BDN-T1E4
- Brand:
- Vishay
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Vishay | |
| Product Type | Power Switch IC | |
| Power Switch Type | Load Switch | |
| Power Switch Topology | High Side | |
| Switch On Resistance RdsOn | 33mΩ | |
| Number of Inputs | 1 | |
| Mount Type | Surface | |
| Package Type | DFN-10 | |
| Minimum Supply Voltage | 2.8V | |
| Pin Count | 10 | |
| Maximum Supply Voltage | 23V | |
| Maximum Operating Temperature | 150°C | |
| Minimum Operating Temperature | -40°C | |
| Operating Current | 6A | |
| Length | 3mm | |
| Standards/Approvals | No | |
| Automotive Standard | No | |
| Series | SiP32434 | |
| Select all | ||
|---|---|---|
Brand Vishay | ||
Product Type Power Switch IC | ||
Power Switch Type Load Switch | ||
Power Switch Topology High Side | ||
Switch On Resistance RdsOn 33mΩ | ||
Number of Inputs 1 | ||
Mount Type Surface | ||
Package Type DFN-10 | ||
Minimum Supply Voltage 2.8V | ||
Pin Count 10 | ||
Maximum Supply Voltage 23V | ||
Maximum Operating Temperature 150°C | ||
Minimum Operating Temperature -40°C | ||
Operating Current 6A | ||
Length 3mm | ||
Standards/Approvals No | ||
Automotive Standard No | ||
Series SiP32434 | ||
Vishay SiP32434 Series Power Switch IC, 6A Operating Current, 23V Maximum Supply Voltage - SIP32434BDN-T1E4
This power switch IC is a compact high‑side load switch designed to manage multiple outputs from a single input in low‑ to mid‑voltage systems. It functions as a multi‑channel power distribution device for electronic assemblies where controlled sequencing and protection of several rails is required. The component is packaged for surface‑mount assembly and is intended for applications demanding concentrated switching capability in a small footprint.
Features and Benefits:
• Low conduction loss with 33mΩ Rds(on) for efficient operation
• Supports up to 6A total operating current for higher load demands
• Accepts supply voltages from 2.8V to 23V for broad voltage compatibility
• Contains five independently controlled outputs to simplify power routing
• Ten‑pin DFN package enables space‑saving surface‑mount integration
• Rated to 150°C maximum operating temperature for elevated thermal conditions
• Supports up to 6A total operating current for higher load demands
• Accepts supply voltages from 2.8V to 23V for broad voltage compatibility
• Contains five independently controlled outputs to simplify power routing
• Ten‑pin DFN package enables space‑saving surface‑mount integration
• Rated to 150°C maximum operating temperature for elevated thermal conditions
Applications
• Suitable for powering multiple peripheral rails on handheld devices
• Ideal for centralised power distribution in industrial modules
• Used with battery management systems requiring multi‑output sequencing
• Can be used for sequencing power to sensors and communication ICs
• Suitable for compact assemblies where board space is limited
• Ideal for centralised power distribution in industrial modules
• Used with battery management systems requiring multi‑output sequencing
• Can be used for sequencing power to sensors and communication ICs
• Suitable for compact assemblies where board space is limited
What input arrangement does it use to feed multiple outputs?
It employs a single input channel that supplies five output switches, enabling one‑source distribution to several loads.
How does the package support PCB assembly and thermal performance?
The component is supplied in a 10‑pin DFN surface‑mount package that facilitates low‑profile placement and improved thermal conduction to the board.
What environmental limits should designers consider for reliability?
The device is rated to operate between -40°C and 150°C, which should be considered when specifying cooling and enclosure conditions.
Can it handle continuous heavy current in compact designs?
With a 6A operating current rating and a low Rds(on) of 33mΩ, it is suitable for sustained higher‑current loads within its thermal limits.
