Molex zSFP+ I/O Connector Female 16-Port 320-Position, 172501-8002
- RS Stock No.:
- 683-585
- Mfr. Part No.:
- 172501-8002
- Brand:
- Molex
Subtotal (1 tray of 2 units)*
£211.17
(exc. VAT)
£253.40
(inc. VAT)
Stock information currently inaccessible
Tray(s) | Per Tray | Per unit* |
---|---|---|
1 + | £211.17 | £105.585 |
*price indicative
- RS Stock No.:
- 683-585
- Mfr. Part No.:
- 172501-8002
- Brand:
- Molex
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
---|---|---|
Brand | Molex | |
Form Factor | zSFP+ | |
Type | I/O Connector | |
Gender | Female | |
Number of Ports | 16 | |
Body Orientation | Right Angle | |
Number of Contacts | 320 | |
Contact Material | High Performance Alloy | |
Select all | ||
---|---|---|
Brand Molex | ||
Form Factor zSFP+ | ||
Type I/O Connector | ||
Gender Female | ||
Number of Ports 16 | ||
Body Orientation Right Angle | ||
Number of Contacts 320 | ||
Contact Material High Performance Alloy | ||
- COO (Country of Origin):
- ID
The Molex zSFP+ Stacked Ganged Assembly with Metal Spring Fingers is expertly designed for high-speed I/O connector applications featuring a compact two-by-eight configuration that optimises airflow. This product effectively accommodates 320 circuits making it ideal for advanced electronic integration. With its robust construction that includes a high-performance alloy and thermoplastic materials this assembly ensures reliable performance across a broad operating temperature range of -40° to +85°C. The unique engineering incorporates EMI shielding to enhance data integrity while maintaining a maximum data rate of 28.0 Gbps. Accurately tailored for module to board applications this versatile receptacle guarantees ease of installation and secure connectivity.
320 circuits for enhanced connection capacity
Engineered for module to board applications providing flexibility
Includes EMI fingers for superior shielding performance
Constructed with high-performance thermoplastic and alloy materials for durability
Right angle orientation simplifies installation in compact spaces
Designed to withstand 100 mating cycles which ensuring long-term usability
PCB retention features enhance stability in electronic assemblies
Tray packaging facilitates easy handling and minimises damage during transit
Engineered for module to board applications providing flexibility
Includes EMI fingers for superior shielding performance
Constructed with high-performance thermoplastic and alloy materials for durability
Right angle orientation simplifies installation in compact spaces
Designed to withstand 100 mating cycles which ensuring long-term usability
PCB retention features enhance stability in electronic assemblies
Tray packaging facilitates easy handling and minimises damage during transit
Related links
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