Adaptive Peltier Module, 72 W, 13.1 A, 8.8V, 40 mm x 40 mm x 4.6 mm
- RS Stock No.:
- 490-1345
- Mfr. Part No.:
- ET-071-20-15-RS
- Brand:
- Adaptive
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£59.16
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£70.99
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- RS Stock No.:
- 490-1345
- Mfr. Part No.:
- ET-071-20-15-RS
- Brand:
- Adaptive
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Adaptive | |
| Maximum Cooling Capacity | 72W | |
| Product Type | Peltier Module | |
| Maximum Temperature Difference | 74°C | |
| Thickness | 4.6mm | |
| Maximum Current | 13.1A | |
| Maximum Voltage | 8.8V | |
| Lead Wire Type | Unstripped | |
| Length | 40mm | |
| Width | 40 mm | |
| Standards/Approvals | RoHS | |
| Series | ET | |
| Select all | ||
|---|---|---|
Brand Adaptive | ||
Maximum Cooling Capacity 72W | ||
Product Type Peltier Module | ||
Maximum Temperature Difference 74°C | ||
Thickness 4.6mm | ||
Maximum Current 13.1A | ||
Maximum Voltage 8.8V | ||
Lead Wire Type Unstripped | ||
Length 40mm | ||
Width 40 mm | ||
Standards/Approvals RoHS | ||
Series ET | ||
- COO (Country of Origin):
- CN
Thermoelectric Cooler Modules, Adaptive
The Thermoelectric modules utilise the Peltier phenomenon principle to pump heat when voltage is applied.
Effective cooling power from mW to a hundred of Watts
Max hot side temperature Th = 90°C for best long term performance
Modules can be bonded using heat sink bonder
Applications in refrigeration and power generation
Silicone sealed options
Max hot side temperature Th = 90°C for best long term performance
Modules can be bonded using heat sink bonder
Applications in refrigeration and power generation
Silicone sealed options
Thermoelectric Modules - Peltier Effect
A range of semiconductor thermoelectric devices working on the Peltier effect. When supplied with a suitable electric current, they can either cool or heat. When subject to an externally applied temperature gradient these devices will generate a small amount of electrical power.The larger devices can be used for cooling or controlling the temperature of sub-assemblies. The small size of the mini module makes it ideally suited for cooling miniature electronic components such as infra-red detector chips, microwave IC's, fibre-optic lasers and detectors.,Alternatively, it may be used to minimise the effects of temperature coefficients on oscillator stability, reference voltages, amplifier offsets etc. by providing temperature control.
Solid-state long term stability
Generates no acoustic noise
Generates no acoustic noise