Adaptive Peltier Module, 11.7W, 2.2A, 8.8V, 18 x 18mm
- RS Stock No.:
- 490-1323
- Mfr. Part No.:
- ET-071-08-15-RS
- Brand:
- Adaptive
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£33.86
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Units | Per unit |
---|---|
1 - 4 | £33.86 |
5 - 9 | £32.17 |
10 - 24 | £31.15 |
25 - 99 | £29.80 |
100 + | £26.41 |
*price indicative
- RS Stock No.:
- 490-1323
- Mfr. Part No.:
- ET-071-08-15-RS
- Brand:
- Adaptive
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
---|---|---|
Brand | Adaptive | |
Maximum Cooling Capacity | 11.7W | |
Maximum Temperature Difference | +74K | |
Maximum Current | 2.2A | |
Maximum Voltage | 8.8V | |
Active Area | 18 x 18mm | |
Active Area Length | 18mm | |
Active Area Thickness | 3.8mm | |
Active Area Width | 18mm | |
Select all | ||
---|---|---|
Brand Adaptive | ||
Maximum Cooling Capacity 11.7W | ||
Maximum Temperature Difference +74K | ||
Maximum Current 2.2A | ||
Maximum Voltage 8.8V | ||
Active Area 18 x 18mm | ||
Active Area Length 18mm | ||
Active Area Thickness 3.8mm | ||
Active Area Width 18mm | ||
- COO (Country of Origin):
- CN
Thermoelectric Cooler Modules, Adaptive
The Thermoelectric modules utilise the Peltier phenomenon principle to pump heat when voltage is applied.
Effective cooling power from mW to a hundred of Watts
Max hot side temperature Th = 90°C for best long term performance
Modules can be bonded using heat sink bonder
Applications in refrigeration and power generation
Silicone sealed options
Max hot side temperature Th = 90°C for best long term performance
Modules can be bonded using heat sink bonder
Applications in refrigeration and power generation
Silicone sealed options

Thermoelectric Modules - Peltier Effect
A range of semiconductor thermoelectric devices working on the Peltier effect. When supplied with a suitable electric current, they can either cool or heat. When subject to an externally applied temperature gradient these devices will generate a small amount of electrical power.The larger devices can be used for cooling or controlling the temperature of sub-assemblies. The small size of the mini module makes it ideally suited for cooling miniature electronic components such as infra-red detector chips, microwave IC's, fibre-optic lasers and detectors.,Alternatively, it may be used to minimise the effects of temperature coefficients on oscillator stability, reference voltages, amplifier offsets etc. by providing temperature control.
Solid-state long term stability
Generates no acoustic noise
Generates no acoustic noise