Samtec SEAM Series Straight Surface PCB Header, 500 Contact(s), 1.27 mm Pitch, 10 Row(s), Shrouded
- RS Stock No.:
- 224-8326
- Mfr. Part No.:
- SEAM-50-03.0-S-10-2-A-K-TR
- Brand:
- Samtec
Currently unavailable
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- RS Stock No.:
- 224-8326
- Mfr. Part No.:
- SEAM-50-03.0-S-10-2-A-K-TR
- Brand:
- Samtec
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Samtec | |
| Product Type | PCB Header | |
| Series | SEAM | |
| Current | 2.7A | |
| Pitch | 1.27mm | |
| Number of Contacts | 500 | |
| Housing Material | Liquid Crystal Polymer | |
| Number of Rows | 10 | |
| Orientation | Straight | |
| Shrouded/Unshrouded | Shrouded | |
| Connector System | Board-to-Board | |
| Mount Type | Surface | |
| Contact Plating | Silver, Tin | |
| Contact Material | Copper Alloy | |
| Termination Type | Solder | |
| Row Pitch | 1.27mm | |
| Minimum Operating Temperature | -55°C | |
| Contact Gender | Male | |
| Maximum Operating Temperature | 125°C | |
| Standards/Approvals | No | |
| Voltage | 240 V | |
| Select all | ||
|---|---|---|
Brand Samtec | ||
Product Type PCB Header | ||
Series SEAM | ||
Current 2.7A | ||
Pitch 1.27mm | ||
Number of Contacts 500 | ||
Housing Material Liquid Crystal Polymer | ||
Number of Rows 10 | ||
Orientation Straight | ||
Shrouded/Unshrouded Shrouded | ||
Connector System Board-to-Board | ||
Mount Type Surface | ||
Contact Plating Silver, Tin | ||
Contact Material Copper Alloy | ||
Termination Type Solder | ||
Row Pitch 1.27mm | ||
Minimum Operating Temperature -55°C | ||
Contact Gender Male | ||
Maximum Operating Temperature 125°C | ||
Standards/Approvals No | ||
Voltage 240 V | ||
The Samtec SEARAY SEAM series is an open-pin-field array PCB header which has 1.27 mm pitch. It maximizes design and routing flexibility for single-ended or differential pair configurations, and for power, signal, or ground. It uses the edge rate contact system which is designed for applications requiring high-mating cycles and 56 Gbps PAM4 performance.
Lower insertion/withdrawal forces
Solder charge termination
Maximum grounding & routing flexibility
Stack heights from 7 mm to 18.5 mm
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