Samtec SEAM Series Straight Surface Mount PCB Header, 160 Contact(s), 1.27mm Pitch, 8 Row(s), Shrouded

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Subtotal (1 reel of 200 units)*

£2,553.40

(exc. VAT)

£3,064.00

(inc. VAT)

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  • Shipping from 27 October 2025
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Units
Per unit
Per Reel*
200 +£12.767£2,553.40

*price indicative

RS Stock No.:
158-5679
Mfr. Part No.:
SEAM-20-03.5-S-08-2-A-K-TR
Brand:
Samtec
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Brand

Samtec

Series

SEAM

Pitch

1.27mm

Number of Contacts

160

Number of Rows

8

Body Orientation

Straight

Shrouded/Unshrouded

Shrouded

Mounting Type

Surface Mount

Connector System

Board to Board

Termination Method

Solder

Contact Material

Copper Alloy

Contact Plating

Gold

Current Rating

1.8A

Voltage Rating

240.0 V

1.27mm SEARAY™ Series Interconnects


SEARAY™ is a 1.27mm high density, high speed board-to-board interconnect system. These SEAM / SEAF Series connectors can be mapped as a single-ended application, differential pair application, or a combination of both. When routed as a single-ended system, SEARAY™ is rated at 12.5 GHz @ -3dB. The SEAM / SEAF Series of High Speed / High Density Open Pin Field Array employs Solder Charge Technology for improved solder joint reliability. These SEAM SEAF Series SEARAY™ High Speed / High Density Open Pin Field Array use the Samtec Edge Rate contact system which gives high speed performance, zippering when mating and unmating as well as lowering insertion and extraction forces.

Various rows high density connectors suitable for board stacking applications
Stack height dependant upon SEAF/SEAM combination from 7 mm
Contact resistance: 5.5 mΩ
Contact Plating: 0.76 μm Gold on contact area with Matte Tin on tail area

.050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Terminal

Up to 500 I/Os
.050" (1.27 mm) pitch
Rugged Edge Rate® contact
Lower insertion/withdrawal forces
Solder charge termination
7 mm - 17.5 mm stack heights
Dual sourced by Molex®
Samtec 28+ Gbps Solution

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