Samtec SEAM Series Straight Surface Mount PCB Header, 400 Contact(s), 1.27mm Pitch, 8 Row(s), Shrouded
- RS Stock No.:
- 180-2736
- Mfr. Part No.:
- SEAM-50-03.5-S-08-2-A-K-TR
- Brand:
- Samtec
Bulk discount available
Subtotal (1 unit)*
£27.94
(exc. VAT)
£33.53
(inc. VAT)
FREE delivery for orders over £50.00
Temporarily out of stock
- Shipping from 20 November 2025
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Units | Per unit |
|---|---|
| 1 - 9 | £27.94 |
| 10 - 49 | £26.20 |
| 50 - 99 | £24.76 |
| 100 - 249 | £24.11 |
| 250 + | £23.49 |
*price indicative
- RS Stock No.:
- 180-2736
- Mfr. Part No.:
- SEAM-50-03.5-S-08-2-A-K-TR
- Brand:
- Samtec
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Samtec | |
| Series | SEAM | |
| Pitch | 1.27mm | |
| Number of Contacts | 400 | |
| Number of Rows | 8 | |
| Body Orientation | Straight | |
| Shrouded/Unshrouded | Shrouded | |
| Mounting Type | Surface Mount | |
| Connector System | Board to Board | |
| Termination Method | Solder | |
| Contact Plating | Gold | |
| Contact Material | Copper Alloy | |
| Current Rating | 2.7A | |
| Voltage Rating | 240.0 V | |
Select all | ||
|---|---|---|
Brand Samtec | ||
Series SEAM | ||
Pitch 1.27mm | ||
Number of Contacts 400 | ||
Number of Rows 8 | ||
Body Orientation Straight | ||
Shrouded/Unshrouded Shrouded | ||
Mounting Type Surface Mount | ||
Connector System Board to Board | ||
Termination Method Solder | ||
Contact Plating Gold | ||
Contact Material Copper Alloy | ||
Current Rating 2.7A | ||
Voltage Rating 240.0 V | ||
1.27mm SEARAY™ Series Interconnects
SEARAY™ is a 1.27mm high density, high speed board-to-board interconnect system. These SEAM / SEAF Series connectors can be mapped as a single-ended application, differential pair application, or a combination of both. When routed as a single-ended system, SEARAY™ is rated at 12.5 GHz @ -3dB. The SEAM / SEAF Series of High Speed / High Density Open Pin Field Array employs Solder Charge Technology for improved solder joint reliability. These SEAM SEAF Series SEARAY™ High Speed / High Density Open Pin Field Array use the Samtec Edge Rate contact system which gives high speed performance, zippering when mating and unmating as well as lowering insertion and extraction forces.
Various rows high density connectors suitable for board stacking applications
Stack height dependant upon SEAF/SEAM combination from 7 mm
Contact resistance: 5.5 mΩ
Contact Plating: 0.76 μm Gold on contact area with Matte Tin on tail area
Stack height dependant upon SEAF/SEAM combination from 7 mm
Contact resistance: 5.5 mΩ
Contact Plating: 0.76 μm Gold on contact area with Matte Tin on tail area
Up to 500 I/Os
.050" (1.27 mm) pitch
Rugged Edge Rate® contact
Lower insertion/withdrawal forces
Solder charge termination
7 mm - 17.5 mm stack heights
Dual sourced by Molex®
Samtec 28+ Gbps Solution
.050" (1.27 mm) pitch
Rugged Edge Rate® contact
Lower insertion/withdrawal forces
Solder charge termination
7 mm - 17.5 mm stack heights
Dual sourced by Molex®
Samtec 28+ Gbps Solution
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