Molex 42375 Series Vertical PCB PCB Header, 7 Contact(s), 2.54 mm Pitch, 1 Row(s), Unshrouded

Subtotal (1 bag of 1000 units)*

£202.20

(exc. VAT)

£242.64

(inc. VAT)

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Per unit*
1 +£202.20£0.202

*price indicative

RS Stock No.:
685-039
Mfr. Part No.:
22-28-5070
Brand:
Molex
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Brand

Molex

Series

42375

Product Type

PCB Header

Current

4A

Pitch

2.54mm

Housing Material

Nylon

Number of Contacts

7

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Unshrouded

Mount Type

PCB

Contact Material

Brass

Contact Plating

Gold

Termination Type

Solder

Row Pitch

2.54mm

Tail Pin Length

3.05mm

Standards/Approvals

RoHS

Voltage

500 V

COO (Country of Origin):
IN
The Molex KK 254 Breakaway Header is a highly versatile connector designed for efficient board-to-board and wire-to-board applications. This active component features a vertical orientation and accommodates up to seven circuits, making it ideal for compact electronic designs that require reliable signal integrity. Crafted with tin-plated contacts and kinked PC tails, this header ensures secure mating and optimal performance, while its robust construction using high-temperature thermoplastic guarantees durability. The compatibility with various terminal housings, receptacles, and crimp housings further enhances its functionality, making it a preferred choice for engineers seeking dependable connectivity solutions in modern PCB layouts.

Accommodates up to seven circuits for flexible connectivity options

Vertical orientation optimises space in compact electronic designs

Tin plating enhances the durability and reliability of electrical contacts

Kinked PC tails provide secure mating and improve thermal performance

High temperature thermoplastic construction ensures longevity in demanding environments

Compatible with a range of terminal and receptacle housings for versatile applications

Designed for board to board and wire to board configurations, facilitating diverse connectivity

Meets flammability standards of 94V0 for increased safety

Low profile design allows for efficient integration into multi layer printed circuit boards

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