Phoenix Contact MCDN Series Straight Solder Mount PCB Header, 10 Contact(s), 3.81mm Pitch, 2 Row(s), Shrouded
- RS Stock No.:
- 520-283
- Mfr. Part No.:
- 1749557
- Brand:
- Phoenix Contact
Subtotal (1 pack of 55 units)*
£358.85
(exc. VAT)
£430.62
(inc. VAT)
FREE delivery for orders over £50.00
Temporarily out of stock
- Shipping from 09 December 2025
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Pack(s) | Per Pack | Per unit* |
---|---|---|
1 + | £358.85 | £6.525 |
*price indicative
- RS Stock No.:
- 520-283
- Mfr. Part No.:
- 1749557
- Brand:
- Phoenix Contact
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
---|---|---|
Brand | Phoenix Contact | |
Series | MCDN | |
Pitch | 3.81mm | |
Number of Contacts | 10 | |
Number of Rows | 2 | |
Body Orientation | Straight | |
Shrouded/Unshrouded | Shrouded | |
Mounting Type | Solder Mount | |
Select all | ||
---|---|---|
Brand Phoenix Contact | ||
Series MCDN | ||
Pitch 3.81mm | ||
Number of Contacts 10 | ||
Number of Rows 2 | ||
Body Orientation Straight | ||
Shrouded/Unshrouded Shrouded | ||
Mounting Type Solder Mount | ||
- COO (Country of Origin):
- DE
The Phoenix Contact PCB Header features a standard pin connector pattern alignment with no locking mechanism. It has no additional mounting method and is packed in cardboard for storage. The mounting type includes THR soldering and wave soldering. The pin layout follows linear pinning, and the contact material is copper alloy. The surface characteristics are tin-plated for enhanced durability, while the insulating material is LCP (Liquid Crystal Polymer) for electrical insulation.
Designed for integration into the SMT soldering process
Maximum flexibility when it comes to device design which is one header for connectors with different connection technologies
Conductor connection on several levels enables higher contact density
Maximum flexibility when it comes to device design which is one header for connectors with different connection technologies
Conductor connection on several levels enables higher contact density
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