Phoenix Contact MCDN Series Through Hole PCB Header, 6 Contact(s), 3.81 mm Pitch, 2 Row(s), Shrouded

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Subtotal (1 pack of 90 units)*

£242.11

(exc. VAT)

£290.53

(inc. VAT)

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RS Stock No.:
492-767
Mfr. Part No.:
1749340
Brand:
Phoenix Contact
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Brand

Phoenix Contact

Product Type

PCB Header

Series

MCDN

Current

8A

Pitch

3.81mm

Housing Material

Liquid Crystal Polymer

Number of Contacts

6

Number of Rows

2

Shrouded/Unshrouded

Shrouded

Mount Type

Through Hole

Connector System

COMBICON FMC 1

Contact Plating

Tin over Nickel

Contact Material

Copper Alloy

Minimum Operating Temperature

-40°C

Row Pitch

3.81mm

Termination Type

Solder

Maximum Operating Temperature

100°C

Tail Pin Length

1.4mm

Contact Gender

Male

Standards/Approvals

cULus Recognised (E60425-20110128), DIN EN 61760-1, IEC 60068-2-58, IEC 60068-2-70:1995-12, IEC 60068-2-82/JEDEC JESD 201, IEC 60112, IEC 60512-1-1:2002-02, IEC 60512-1-2:2002-02, IEC 60512-13-5:2006-02, IEC 60512-15-1:2008-05, IEC 60512-3-1:2002-02, IEC 60512-5-1:2002-02, IEC 60664-1:2007-04, IPC/JEDEC J-STD-020-C, ISO 6988:1985-02, UL 94 V0, VDE (40011723)

Mating Pin Length

1.4mm

Voltage

160 V

COO (Country of Origin):
DE
The Phoenix Contact MCDN 1.5/3-G1-3.81 P14THR is a high-quality PCB header designed for effective integration into various electronic devices. This versatile component boasts a linear pinning layout and is specifically suitable for through hole reflow soldering, catering to a range of connection technologies. Its robust construction and thoughtful design enable higher contact density while allowing maximum flexibility in device design. The product ranges in applications requiring reliable electrical connections, making it essential for contemporary electronic assemblies. With a nominal current capacity of 8 A and a rated voltage of up to 160 V, this PCB header ensures dependable and safe operation across diverse environments, from offices to industrial settings. Moreover, the innovative design affords effortless assembly and durability, positioning it as an ideal choice for manufacturers seeking quality and performance.

Designed for seamless integration into the SMT soldering process

Allows for enhanced flexibility in device configurations and layout

Manufactured to meet stringent quality standards for reliability

Accommodates multiple connection technologies for diverse applications

Features a compact design that facilitates higher density connections

Ensures efficient heat management during the soldering process

Constructed with materials that comply with WEEE and RoHS regulations

Provides a moisture-sensitive level rating for safe handling

Supports a wide operating temperature range for versatile applications

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