Phoenix Contact MCDN Series Straight Wave Soldering PCB Header, 20 Contact(s), 3.81mm Pitch, 2 Row(s), Shrouded
- RS Stock No.:
- 558-031
- Mfr. Part No.:
- 1749528
- Brand:
- Phoenix Contact
Subtotal (1 pack of 130 units)*
£182.10
(exc. VAT)
£218.52
(inc. VAT)
FREE delivery for orders over £50.00
Temporarily out of stock
- Shipping from 05 December 2025
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Pack(s) | Per Pack | Per unit* |
---|---|---|
1 + | £182.10 | £1.401 |
*price indicative
- RS Stock No.:
- 558-031
- Mfr. Part No.:
- 1749528
- Brand:
- Phoenix Contact
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
---|---|---|
Brand | Phoenix Contact | |
Series | MCDN | |
Pitch | 3.81mm | |
Number of Contacts | 20 | |
Number of Rows | 2 | |
Body Orientation | Straight | |
Shrouded/Unshrouded | Shrouded | |
Mounting Type | Wave Soldering | |
Select all | ||
---|---|---|
Brand Phoenix Contact | ||
Series MCDN | ||
Pitch 3.81mm | ||
Number of Contacts 20 | ||
Number of Rows 2 | ||
Body Orientation Straight | ||
Shrouded/Unshrouded Shrouded | ||
Mounting Type Wave Soldering | ||
- COO (Country of Origin):
- DE
The Phoenix Contact PCB header is meticulously designed for seamless integration into the SMT soldering processes, ensuring reliability and efficiency in electronic connections. This component boasts a flexible design that accommodates various connection technologies, allowing for greater versatility in device architecture. With a robust construction featuring a nominal current of 8 A and a rated voltage of 160 V, it provides dependable performance across multiple applications. The through-hole reflow technology enhances assembly precision, while the compact dimensions ensure ease of installation without compromising on quality. This product is an ideal solution for engineers seeking to optimise space and contact density in their designs.
Integrates effortlessly with SMT soldering processes for enhanced efficiency
Offers flexibility for various connection technologies in device design
Enables high contact density through multi-level conductor connections
Presents a compact footprint, allowing for space-efficient applications
Manufactured from high-quality materials ensuring durability and reliability
Complies with WEEE/RoHS for environmentally-friendly operation
Designed for effective thermal management during the soldering process
Tested for a wide temperature range, suitable for diverse operational environments
Features multiple rows and potential connections for versatile circuit options
Offers flexibility for various connection technologies in device design
Enables high contact density through multi-level conductor connections
Presents a compact footprint, allowing for space-efficient applications
Manufactured from high-quality materials ensuring durability and reliability
Complies with WEEE/RoHS for environmentally-friendly operation
Designed for effective thermal management during the soldering process
Tested for a wide temperature range, suitable for diverse operational environments
Features multiple rows and potential connections for versatile circuit options
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