Phoenix Contact MCDNV Series Vertical Through Hole PCB Header, 6 Contact(s), 3.5mm Pitch, 2 Row(s), Shrouded

The Phoenix Contact MCDNV 1.5/3-G1-3.5 RNP14THR PCB header is expertly designed for seamless integration into contemporary SMT soldering processes. Its innovative pin layout allows for a compact multi-row arrangement, ensuring efficient use of board space. This component is tailored for through-hole reflow technology and exhibits exceptional reliability across various electrical requirements. With a combination of robust construction and intuitive locking mechanisms, it is ideal for applications requiring enhanced durability and stability. The header offers a versatile solution with multiple connection potentials, catering to diverse project needs while maintaining stringent compliance with industry standards.

Designed for compatibility with through-hole reflow soldering
Snap-in locking mechanism ensures secure connections
Vertical arrangement optimises PCB space
Constructed with durable and reliable materials
User-friendly design facilitates easy integration into existing systems
Maintains consistent performance across a wide range of temperatures
Meets rigorous electrical and mechanical testing standards
Compliant with WEEE and RoHS directives for environmental responsibility
Packaging designed for protection during transport and storage