Phoenix Contact MCDNV Series Straight Through Hole PCB Header, 8 Contact(s), 3.5 mm Pitch, 2 Row(s), Shrouded

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Subtotal (1 pack of 65 units)*

£299.35

(exc. VAT)

£359.22

(inc. VAT)

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RS Stock No.:
483-453
Mfr. Part No.:
1952474
Brand:
Phoenix Contact
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Brand

Phoenix Contact

Product Type

PCB Header

Series

MCDNV

Pitch

3.5mm

Current

8A

Housing Material

Liquid Crystal Polymer

Number of Contacts

8

Number of Rows

2

Orientation

Straight

Shrouded/Unshrouded

Shrouded

Connector System

COMBICON FMC 1

Mount Type

Through Hole

Contact Material

Copper Alloy

Contact Plating

Tin Plated

Row Pitch

3.5mm

Minimum Operating Temperature

-40°C

Tail Pin Length

2.6mm

Contact Gender

Male

Maximum Operating Temperature

100°C

Standards/Approvals

cULus Recognised, VDE approval

Mating Pin Length

2.6mm

Voltage

160 V

COO (Country of Origin):
DE
The Phoenix Contact PCB header is designed for efficient through-hole reflow soldering, enhancing the reliability of your electronic connections. With its robust construction and intuitive locking mechanism, it effectively prevents accidental disconnections, making it an ideal choice for compact circuit designs. The innovative vertical connection allows for a multi-row arrangement on the PCB, optimising space utilisation. Part of the MCDNV 1.5/-G1-RN-THR series, it complies with established industry standards to ensure superior performance. This product is a perfect blend of functionality and durability, catering to a wide range of applications while ensuring ease of integration into existing systems.

Designed for seamless integration into SMT soldering processes

Features a snap-in locking mechanism for secure connections

Supports a multi-row arrangement, saving valuable board space

Constructed with WEEE/RoHS compliance for environmental sustainability

Capable of withstanding extreme temperatures for reliable operation

Incorporates high-quality tin-plated contacts for efficient conductivity

Offers a lightweight design, making it easy to handle and install

Engineered to harmonise with various pin layouts for flexibility

Perfectly suited for high-density applications requiring compact solutions

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