Phoenix Contact MCDNV Series Straight Solder Mount PCB Header, 32 Contact(s), 3.5mm Pitch, 2 Row(s), Shrouded
- RS Stock No.:
- 556-622
- Mfr. Part No.:
- 1952924
- Brand:
- Phoenix Contact
Subtotal (1 pack of 40 units)*
£977.00
(exc. VAT)
£1,172.40
(inc. VAT)
FREE delivery for orders over £50.00
Temporarily out of stock
- Shipping from 15 December 2025
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Pack(s) | Per Pack | Per unit* |
---|---|---|
1 + | £977.00 | £24.425 |
*price indicative
- RS Stock No.:
- 556-622
- Mfr. Part No.:
- 1952924
- Brand:
- Phoenix Contact
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
---|---|---|
Brand | Phoenix Contact | |
Series | MCDNV | |
Pitch | 3.5mm | |
Number of Contacts | 32 | |
Number of Rows | 2 | |
Body Orientation | Straight | |
Shrouded/Unshrouded | Shrouded | |
Mounting Type | Solder Mount | |
Select all | ||
---|---|---|
Brand Phoenix Contact | ||
Series MCDNV | ||
Pitch 3.5mm | ||
Number of Contacts 32 | ||
Number of Rows 2 | ||
Body Orientation Straight | ||
Shrouded/Unshrouded Shrouded | ||
Mounting Type Solder Mount | ||
- COO (Country of Origin):
- DE
The Phoenix Contact PCB Header is part of the COMBICON Connectors S product line and is suitable for through-hole reflow. The mounting type supports both THR soldering and wave soldering. The pin layout is linear pinning, with contacts made from copper alloy. The surface is tin-plated, and the insulating material is LCP (Liquid Crystal Polymer).
Designed for integration into the SMT soldering process
Vertical connection enables multi row arrangement on the PCB
Maximum flexibility when it comes to device design which is one header for connectors with different connection technologies
Conductor connection on several levels enables higher contact density
Vertical connection enables multi row arrangement on the PCB
Maximum flexibility when it comes to device design which is one header for connectors with different connection technologies
Conductor connection on several levels enables higher contact density
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