Phoenix Contact MCDNV Series Vertical Wave Soldering PCB Header, 20 Contact(s), 3.5mm Pitch, 2 Row(s), Shrouded
- RS Stock No.:
- 556-460
- Mfr. Part No.:
- 1953088
- Brand:
- Phoenix Contact
Subtotal (1 pack of 30 units)*
£635.52
(exc. VAT)
£762.62
(inc. VAT)
FREE delivery for orders over £50.00
Temporarily out of stock
- 999,999,999 unit(s) shipping from 15 December 2025
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Pack(s) | Per Pack | Per unit* |
---|---|---|
1 + | £635.52 | £21.184 |
*price indicative
- RS Stock No.:
- 556-460
- Mfr. Part No.:
- 1953088
- Brand:
- Phoenix Contact
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
---|---|---|
Brand | Phoenix Contact | |
Series | MCDNV | |
Pitch | 3.5mm | |
Number of Contacts | 20 | |
Number of Rows | 2 | |
Body Orientation | Vertical | |
Shrouded/Unshrouded | Shrouded | |
Mounting Type | Wave Soldering | |
Select all | ||
---|---|---|
Brand Phoenix Contact | ||
Series MCDNV | ||
Pitch 3.5mm | ||
Number of Contacts 20 | ||
Number of Rows 2 | ||
Body Orientation Vertical | ||
Shrouded/Unshrouded Shrouded | ||
Mounting Type Wave Soldering | ||
- COO (Country of Origin):
- DE
The Phoenix Contact PCB header is designed for seamless integration into modern electronic applications. Its innovative configuration offers exceptional flexibility, allowing for a multi-row arrangement that optimises space on printed circuit boards. Built with reliability in mind, the product supports various connection technologies, catering to diverse design needs. The header's robust construction ensures a solid performance, with a significant contact density that maintains electrical integrity. With its user-friendly design tailored for through-hole reflow technology, this component provides an efficient solution for todays sophisticated circuit assemblies.
Vertical connection allows for a compact multi-row layout
Compatible with various connection technologies for design versatility
Optimised pin layout improves contact density and reliability
Engineered for through-hole reflow technology, enhancing assembly efficiency
Moisture sensitive level rated for robust handling during production
Tested for durability and insulation to ensure long-lasting performance
Designed to withstand extreme temperatures for versatile application usage
Compatible with various connection technologies for design versatility
Optimised pin layout improves contact density and reliability
Engineered for through-hole reflow technology, enhancing assembly efficiency
Moisture sensitive level rated for robust handling during production
Tested for durability and insulation to ensure long-lasting performance
Designed to withstand extreme temperatures for versatile application usage
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