TE Connectivity AMPMODU Series Right Angle Board PCB Header, 14 Contact(s), 2.54 mm Pitch, 2 Row(s), Shrouded

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Subtotal (1 tray of 20 units)*

£181.03

(exc. VAT)

£217.24

(inc. VAT)

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Tray(s)
Per Tray
Per unit*
1 +£181.03£9.052

*price indicative

RS Stock No.:
480-238
Mfr. Part No.:
103167-4
Brand:
TE Connectivity
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Brand

TE Connectivity

Product Type

PCB Header

Series

AMPMODU

Pitch

2.54mm

Current

3A

Number of Contacts

14

Housing Material

Thermoplastic

Number of Rows

2

Orientation

Right Angle

Shrouded/Unshrouded

Shrouded

Mount Type

Board

Connector System

Wire-to-Board

Contact Material

Phosphor Bronze

Contact Plating

Gold

Row Pitch

2.54mm

Minimum Operating Temperature

65°C

Termination Type

Solder

Maximum Operating Temperature

105°C

Tail Pin Length

3.43mm

Standards/Approvals

CSA LR7189, UL E28476

Voltage

750 Vrms

Distrelec Product Id

304-48-458

Non Compliant

COO (Country of Origin):
US
The TE Connectivity PCB Mount Header is engineered for precision and reliability in wire-to-board applications, offering a robust solution for connecting components in various electronic devices. Its right-angle configuration ensures optimal space utilization on PCBs while providing industry-standard connectivity. Constructed with a fully shrouded design, this connector guarantees secure mating and improved contact performance. Ideal for situations requiring a high degree of reliability, the product is suited for applications across diverse industries, thanks to its high insulation resistance and dielectric withstand voltage specifications. The durable material composition enhances longevity and performance, making it a preferred choice for both manufacturers and engineers seeking dependable electrical connections.

Right-angle mounting optimizes PCB layouts and saves space

Fully shrouded design enhances contact security during mating

Equipped with gold plating for superior conductivity and durability

Nickel underplating adds an extra layer of protection for the contacts

Mechanical polarization ensures correct alignment during installation

Rated for temperatures ranging from -65°C to 105°C, accommodating diverse environments

Compatible with wave soldering processes for efficient assembly

Dual rows increase connection density without increasing footprint

Tray packaging maximizes production efficiency for large-scale applications

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