onsemi N-Channel MOSFET, 2.2 A, 30 V, 3-Pin SOT-23 FDN337N
- RS Stock No.:
- 124-1703
- Mfr. Part No.:
- FDN337N
- Brand:
- onsemi
Subtotal (1 reel of 3000 units)*
£426.00
(exc. VAT)
£510.00
(inc. VAT)
FREE delivery for orders over £50.00
- 9,000 left, ready to ship
Units | Per unit | Per Reel* |
---|---|---|
3000 + | £0.142 | £426.00 |
*price indicative
- RS Stock No.:
- 124-1703
- Mfr. Part No.:
- FDN337N
- Brand:
- onsemi
Select all | Attribute | Value |
---|---|---|
Brand | onsemi | |
Channel Type | N | |
Maximum Continuous Drain Current | 2.2 A | |
Maximum Drain Source Voltage | 30 V | |
Package Type | SOT-23 | |
Mounting Type | Surface Mount | |
Pin Count | 3 | |
Maximum Drain Source Resistance | 65 mΩ | |
Channel Mode | Enhancement | |
Maximum Gate Threshold Voltage | 1V | |
Minimum Gate Threshold Voltage | 0.4V | |
Maximum Power Dissipation | 500 mW | |
Transistor Configuration | Single | |
Maximum Gate Source Voltage | -8 V, +8 V | |
Number of Elements per Chip | 1 | |
Maximum Operating Temperature | +150 °C | |
Length | 2.92mm | |
Width | 1.4mm | |
Typical Gate Charge @ Vgs | 7 nC @ 4.5 V | |
Transistor Material | Si | |
Height | 0.94mm | |
Minimum Operating Temperature | -55 °C | |
Select all | ||
---|---|---|
Brand onsemi | ||
Channel Type N | ||
Maximum Continuous Drain Current 2.2 A | ||
Maximum Drain Source Voltage 30 V | ||
Package Type SOT-23 | ||
Mounting Type Surface Mount | ||
Pin Count 3 | ||
Maximum Drain Source Resistance 65 mΩ | ||
Channel Mode Enhancement | ||
Maximum Gate Threshold Voltage 1V | ||
Minimum Gate Threshold Voltage 0.4V | ||
Maximum Power Dissipation 500 mW | ||
Transistor Configuration Single | ||
Maximum Gate Source Voltage -8 V, +8 V | ||
Number of Elements per Chip 1 | ||
Maximum Operating Temperature +150 °C | ||
Length 2.92mm | ||
Width 1.4mm | ||
Typical Gate Charge @ Vgs 7 nC @ 4.5 V | ||
Transistor Material Si | ||
Height 0.94mm | ||
Minimum Operating Temperature -55 °C | ||
Enhancement Mode N-Channel MOSFET, Fairchild Semiconductor
ON Semi MOSFETs provide superior design reliability from reduced voltage spikes and overshoot, to lower junction capacitance and reverse recovery charge, to elimination of additional external components to keep systems up and running longer.
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