TDK 1 μF Multilayer Ceramic Capacitor, 25V dc, ±10 %, Surface Mount
- RS Stock No.:
- 242-7455
- Mfr. Part No.:
- CGA3E1X7R1E105K080AE
- Brand:
- TDK
Subtotal (1 reel of 4000 units)*
£152.00
(exc. VAT)
£184.00
(inc. VAT)
FREE delivery for orders over £60.00
In Stock
- 4,000 unit(s) ready to ship
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per unit | Per Reel* |
|---|---|---|
| 4000 + | £0.038 | £152.00 |
*price indicative
- RS Stock No.:
- 242-7455
- Mfr. Part No.:
- CGA3E1X7R1E105K080AE
- Brand:
- TDK
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | TDK | |
| Capacitance | 1μF | |
| Product Type | Multilayer Ceramic Capacitor | |
| Voltage | 25V dc | |
| Package/Case | 0603 | |
| Construction | Stacked | |
| Mount Type | Surface Mount | |
| Packaging | Tape & Reel | |
| Dielectric | X7R | |
| Tolerance | ±10 % | |
| Automotive Standard | AEC-Q200 | |
| Minimum Operating Temperature | -55°C | |
| Termination Type | Solder | |
| Series | CGA | |
| Standards/Approvals | RoHS, REACH | |
| Width | 0.8mm | |
| Height | 0.8mm | |
| Length | 1.6mm | |
| Maximum Operating Temperature | 125°C | |
| Select all | ||
|---|---|---|
Brand TDK | ||
Capacitance 1μF | ||
Product Type Multilayer Ceramic Capacitor | ||
Voltage 25V dc | ||
Package/Case 0603 | ||
Construction Stacked | ||
Mount Type Surface Mount | ||
Packaging Tape & Reel | ||
Dielectric X7R | ||
Tolerance ±10 % | ||
Automotive Standard AEC-Q200 | ||
Minimum Operating Temperature -55°C | ||
Termination Type Solder | ||
Series CGA | ||
Standards/Approvals RoHS, REACH | ||
Width 0.8mm | ||
Height 0.8mm | ||
Length 1.6mm | ||
Maximum Operating Temperature 125°C | ||
The TDK soft termination CGA series, automotive grade of TDK's multilayer ceramic chip capacitor, is a product incorporating a conductive resin layer into the terminal electrodes. The resin layer protects the ceramic body from cracks by relieving stress caused by thermal shock and board flexure. It is used in applications such as fail safe design for battery line, prevention of ceramic element crack by board bending, prevention of solder crack by thermal shock, equipment such as mobile devices and smart key having a high possibility of drop.
High resistance to mechanical stress and thermal shock by resin layers
X8R and X8L type whose maximum temperature are up to 150 degree Celsius are available
C0G type having excellent stable temperature and DC-bias characteristics is also available
AEC-Q20
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