TDK 4.7μF Multilayer Ceramic Capacitor MLCC, 35V dc V, ±10% , SMD
- RS Stock No.:
- 179-5435
- Mfr. Part No.:
- CGA4J1X7R1V475K125AE
- Brand:
- TDK
Subtotal (1 pack of 25 units)*
£5.575
(exc. VAT)
£6.70
(inc. VAT)
FREE delivery for orders over £50.00
In Stock
- Plus 50 unit(s) shipping from 20 October 2025
- Plus 64,750 unit(s) shipping from 27 October 2025
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per unit | Per Pack* |
---|---|---|
25 + | £0.223 | £5.58 |
*price indicative
- RS Stock No.:
- 179-5435
- Mfr. Part No.:
- CGA4J1X7R1V475K125AE
- Brand:
- TDK
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
---|---|---|
Brand | TDK | |
Capacitance | 4.7µF | |
Voltage | 35V dc | |
Package/Case | 0805 (2012M) | |
Mounting Type | Surface Mount | |
Dielectric | X7R | |
Tolerance | ±10% | |
Dimensions | 2 x 1.25 x 1.25mm | |
Automotive Standard | AEC-Q200 | |
Length | 2mm | |
Depth | 1.25mm | |
Height | 1.25mm | |
Series | CGA | |
Maximum Operating Temperature | +125°C | |
Minimum Operating Temperature | -55°C | |
Suppression Class | Class 2 | |
Select all | ||
---|---|---|
Brand TDK | ||
Capacitance 4.7µF | ||
Voltage 35V dc | ||
Package/Case 0805 (2012M) | ||
Mounting Type Surface Mount | ||
Dielectric X7R | ||
Tolerance ±10% | ||
Dimensions 2 x 1.25 x 1.25mm | ||
Automotive Standard AEC-Q200 | ||
Length 2mm | ||
Depth 1.25mm | ||
Height 1.25mm | ||
Series CGA | ||
Maximum Operating Temperature +125°C | ||
Minimum Operating Temperature -55°C | ||
Suppression Class Class 2 | ||
- COO (Country of Origin):
- JP
TDK multilayer ceramic chip capacitor_Soft termination_Automotive grade_CGA series is a product which conductive resin layers are included in terminations. Soft termination series has higher mechanical endurance by the flexible resin layers which absorbs thermal and mechanical stress.
FEATURES
Higher mechanical endurance is realized by flexible resin layers.
X8R type which maximum temperature is up to 150°C is applicable.
C0G temperature characteristic which has excellent stable temperature and DC-bias characteristics is applicable.
APPLICATIONS
Fail-safe design in battery line.
Prevention of ceramic body cracks by board bending.
Prevention of solder cracks by thermal shock.
The set having a high probability of fall such as keyless entry and
Smart-key
Higher mechanical endurance is realized by flexible resin layers.
X8R type which maximum temperature is up to 150°C is applicable.
C0G temperature characteristic which has excellent stable temperature and DC-bias characteristics is applicable.
APPLICATIONS
Fail-safe design in battery line.
Prevention of ceramic body cracks by board bending.
Prevention of solder cracks by thermal shock.
The set having a high probability of fall such as keyless entry and
Smart-key
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