TDK 1μF Multilayer Ceramic Capacitor MLCC, 450V dc V, ±10% , SMD
- RS Stock No.:
- 111-0582
- Mfr. Part No.:
- C5750X7T2W105K250KE
- Brand:
- TDK
Subtotal (1 reel of 500 units)*
£689.00
(exc. VAT)
£827.00
(inc. VAT)
FREE delivery for orders over £50.00
Temporarily out of stock
- Shipping from 12 January 2026
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per unit | Per Reel* |
---|---|---|
500 + | £1.378 | £689.00 |
*price indicative
- RS Stock No.:
- 111-0582
- Mfr. Part No.:
- C5750X7T2W105K250KE
- Brand:
- TDK
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
---|---|---|
Brand | TDK | |
Capacitance | 1µF | |
Voltage | 450V dc | |
Package/Case | 2220 (5750M) | |
Mounting Type | Surface Mount | |
Dielectric | X7T | |
Tolerance | ±10% | |
Dimensions | 5.7 x 5 x 2.5mm | |
Length | 5.7mm | |
Depth | 5mm | |
Height | 2.5mm | |
Series | C | |
Minimum Operating Temperature | -55°C | |
Terminal Type | Surface Mount | |
Maximum Operating Temperature | +125°C | |
Select all | ||
---|---|---|
Brand TDK | ||
Capacitance 1µF | ||
Voltage 450V dc | ||
Package/Case 2220 (5750M) | ||
Mounting Type Surface Mount | ||
Dielectric X7T | ||
Tolerance ±10% | ||
Dimensions 5.7 x 5 x 2.5mm | ||
Length 5.7mm | ||
Depth 5mm | ||
Height 2.5mm | ||
Series C | ||
Minimum Operating Temperature -55°C | ||
Terminal Type Surface Mount | ||
Maximum Operating Temperature +125°C | ||
- COO (Country of Origin):
- JP
TDK C Series 2220 (5750) Soft Terminal
Soft Termination C Series MLCC have improved board bending resistance, drop impact resistance,
thermal shock resistance, and heat cycle properties
thermal shock resistance, and heat cycle properties
Conductive resin absorb external stress to protect solder joint parts and capacitor body
Compliance with the RoHS Directive
Compliance with the RoHS Directive
Applications:
Switching power supply
Telecom base station
Electronic circuits mounted on alumina substrate
SMT application which requires bending robustness in which solder joint reliability is problematic
Telecom base station
Electronic circuits mounted on alumina substrate
SMT application which requires bending robustness in which solder joint reliability is problematic
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