TE Connectivity 0.5 mm Pitch 260 Way, Right Angle Board Mount DIMM Socket ,1.2 V, 500mA

Subtotal (1 reel of 250 units)*

£378.54

(exc. VAT)

£454.25

(inc. VAT)

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Per Reel
Per unit*
1 +£378.54£1.514

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RS Stock No.:
481-905
Distrelec Article No.:
304-59-558
Mfr. Part No.:
2309414-3
Brand:
TE Connectivity
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Brand

TE Connectivity

Memory Socket Type

DIMM

Product Type

DIMM Socket

Insertion/Removal Method

Cam-In

Orientation

Right Angle

Contact Material

Copper Alloy

Current

500mA

Contact Plating

Gold

Number of Contacts

260

Pitch

0.5mm

Mount Type

Board

Housing Material

High Temperature Thermoplastic

Termination Type

Surface Mount

Minimum Operating Temperature

-55°C

Latching

Yes

Maximum Operating Temperature

85°C

Row Spacing

8.2mm

Standards/Approvals

UL 94 V-0

Series

DDR4 DIMM

Voltage

1.2 V

COO (Country of Origin):
CN
The TE Connectivity Small outline DDR4 SO DIMM socket is engineered for superior performance and reliability in compact electronic applications. With a stack height of just 9.2 mm and a right angle module orientation, it facilitates efficient space utilisation while ensuring robust connections. This socket accommodates up to 260 positions and features a .5 mm centreline pitch, designed specifically for high-speed memory applications. Its high-temperature thermoplastic housing guarantees durability, while innovative design elements, such as reverse keying and locking ejectors, enhance user experience during installation and maintenance. The product complies with stringent industry standards and regulations, making it an ideal choice for modern computing environments.

Designed for seamless integration into high speed memory solutions

Constructed from materials that ensure longevity and reliable performance

Includes advanced mounting features for secure PCB attachment

Optimised for a wide operating temperature range for versatile applications

Features low halogen materials promoting environmentally friendly use

Facilitates straightforward installation with intuitive alignment mechanisms

Accommodates a variety of memory configurations to meet diverse needs

Backed by comprehensive compliance documentation to support regulatory requirements

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