TE Connectivity 0.6mm Pitch 200 Way, Right Angled Board Mount Mount DDR 2 DIMM Socket ,1.8 V ,500mA
- RS Stock No.:
- 474-957
- Mfr. Part No.:
- 1612773-4
- Brand:
- TE Connectivity
Subtotal (1 tray of 25 units)*
£139.39
(exc. VAT)
£167.27
(inc. VAT)
FREE delivery for orders over £50.00
Temporarily out of stock
- Shipping from 01 December 2025
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Tray(s) | Per Tray | Per unit* |
---|---|---|
1 + | £139.39 | £5.576 |
*price indicative
- RS Stock No.:
- 474-957
- Mfr. Part No.:
- 1612773-4
- Brand:
- TE Connectivity
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
---|---|---|
Brand | TE Connectivity | |
Memory Socket Type | DIMM Socket | |
Gender | Socket | |
Body Orientation | Right Angled | |
Contact Material | Copper Alloy | |
Contact Plating | Gold Flash | |
Number of Contacts | 200 | |
Pitch | 0.6mm | |
Mounting Type | Board Mount | |
SDRAM Type | DDR 2 | |
Current Rating | 500mA | |
Voltage Rating | 1.8 V | |
Select all | ||
---|---|---|
Brand TE Connectivity | ||
Memory Socket Type DIMM Socket | ||
Gender Socket | ||
Body Orientation Right Angled | ||
Contact Material Copper Alloy | ||
Contact Plating Gold Flash | ||
Number of Contacts 200 | ||
Pitch 0.6mm | ||
Mounting Type Board Mount | ||
SDRAM Type DDR 2 | ||
Current Rating 500mA | ||
Voltage Rating 1.8 V | ||
- COO (Country of Origin):
- CN
The TE Connectivity Socket is engineered to provide dependable connectivity in dynamic computing environments. With a right-angle module orientation and a stack height of 6.5 mm, it delivers optimal space efficiency, making it ideal for compact designs. This versatile socket is designed for high-performance memory applications, supporting double data rate technology to facilitate rapid data transfer. Its robust construction ensures longevity and reliability, while the advanced termination method simplifies integration onto PCB surfaces. Perfect for varied memory applications, it represents a blend of innovation and functionality, ensuring seamless operation in your devices.
Designed for high-performance memory solutions
Offering efficient space utilisation for compact applications
Robust design ensures long-lasting performance and reliability
Facilitates rapid data transfer with double data rate technology
Innovative termination method enhances integration ease
Offering efficient space utilisation for compact applications
Robust design ensures long-lasting performance and reliability
Facilitates rapid data transfer with double data rate technology
Innovative termination method enhances integration ease
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