Infineon FP75R12N2T7BPSA1 3 Phase IGBT, 75 A 1200 V, 31-Pin Module, Chassis Mount
- RS Stock No.:
- 232-6718
- Mfr. Part No.:
- FP75R12N2T7BPSA1
- Brand:
- Infineon
Subtotal (1 tray of 10 units)*
£907.00
(exc. VAT)
£1,088.40
(inc. VAT)
FREE delivery for orders over £50.00
Temporarily out of stock
- 999,999,990 unit(s) shipping from 29 October 2025
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per unit | Per Tray* |
---|---|---|
10 + | £90.70 | £907.00 |
*price indicative
- RS Stock No.:
- 232-6718
- Mfr. Part No.:
- FP75R12N2T7BPSA1
- Brand:
- Infineon
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
---|---|---|
Brand | Infineon | |
Maximum Continuous Collector Current | 75 A | |
Maximum Collector Emitter Voltage | 1200 V | |
Maximum Gate Emitter Voltage | ±20V | |
Number of Transistors | 7 | |
Maximum Power Dissipation | 20 mW | |
Package Type | Module | |
Configuration | 3 Phase | |
Mounting Type | Chassis Mount | |
Channel Type | N | |
Pin Count | 31 | |
Transistor Configuration | 3 Phase | |
Select all | ||
---|---|---|
Brand Infineon | ||
Maximum Continuous Collector Current 75 A | ||
Maximum Collector Emitter Voltage 1200 V | ||
Maximum Gate Emitter Voltage ±20V | ||
Number of Transistors 7 | ||
Maximum Power Dissipation 20 mW | ||
Package Type Module | ||
Configuration 3 Phase | ||
Mounting Type Chassis Mount | ||
Channel Type N | ||
Pin Count 31 | ||
Transistor Configuration 3 Phase | ||
The Infineon's EconoPIM 2, 75 A three phase PIM IGBT module comes with TRENCHSTOP IGBT7, Emitter Controlled 7 diode and NTC. The PIM (Power Integrated Modules) with integration of rectifier and brake chopper enables system cost savings. Also available with PressFIT technology. Potential applications include auxiliary inverters, motor drives and servo drives.
RoHS-compliant modules
Copper base plate for optimized heat spread
High power density
Copper base plate for optimized heat spread
High power density
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