Fischer Elektronik Heatsink, Universal Square Alu, 13.8K/W 10 mm 40 mm 40mm
- RS Stock No.:
- 674-4769
- Mfr. Part No.:
- ICK BGA 40x40x10
- Brand:
- Fischer Elektronik
Currently unavailable
Sorry, we don't know when this will be back in stock.
- RS Stock No.:
- 674-4769
- Mfr. Part No.:
- ICK BGA 40x40x10
- Brand:
- Fischer Elektronik
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Fischer Elektronik | |
| Product Type | Heatsink | |
| For Use With | Universal Square Alu | |
| Length | 40mm | |
| Width | 40mm | |
| Height | 10mm | |
| Thermal Resistance | 13.8K/W | |
| Fastening | Clamp, Conductive Adhesive, Screw, Thermally conductive adhesive | |
| Colour | Black | |
| Finish | Black Anodised | |
| Compatible Package Type | BGA | |
| Standards/Approvals | No | |
| Application | Power PC, Cooler, PLCC, Semiconductor, Ic Processors, Fan, Thermal, Microprocessor, SMD, Pin Heat Sinks, PGA, Heat Sink For IC, Bga | |
| Material | Aluminium | |
| Select all | ||
|---|---|---|
Brand Fischer Elektronik | ||
Product Type Heatsink | ||
For Use With Universal Square Alu | ||
Length 40mm | ||
Width 40mm | ||
Height 10mm | ||
Thermal Resistance 13.8K/W | ||
Fastening Clamp, Conductive Adhesive, Screw, Thermally conductive adhesive | ||
Colour Black | ||
Finish Black Anodised | ||
Compatible Package Type BGA | ||
Standards/Approvals No | ||
Application Power PC, Cooler, PLCC, Semiconductor, Ic Processors, Fan, Thermal, Microprocessor, SMD, Pin Heat Sinks, PGA, Heat Sink For IC, Bga | ||
Material Aluminium | ||
- COO (Country of Origin):
- DE
Fischer Elektronik ICK BGA Series Heatsink
ICK BGA series of heatsinks have been designed for use within IC processor heat dissipation. The series can be mounted via thermal adhesive orconductive foil (not included).
Features and Benefits
Black anodised surface.
Heatsink dimensions match respective BGA-type.
Can be affixed directly on to the BGA component with thermal adhesive or conductive foil (not included).
BGA Heatsinks
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