Fischer Elektronik Heatsink, Universal Square Alu, 13.5K/W 22 mm 27 mm 27mm
- RS Stock No.:
- 674-4753
- Mfr. Part No.:
- ICK BGA 27x27x22
- Brand:
- Fischer Elektronik
Bulk discount available
View bulk pricing optionsSubtotal (1 unit)*
£10.91
(exc. VAT)
£13.09
(inc. VAT)
FREE delivery for orders over £60.00
In Stock
- 43 unit(s) ready to ship from another location
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per unit |
|---|---|
| 1 - 9 | £10.91 |
| 10 - 24 | £10.05 |
| 25 - 49 | £9.59 |
| 50 - 99 | £9.27 |
| 100 + | £8.51 |
*price indicative
- RS Stock No.:
- 674-4753
- Mfr. Part No.:
- ICK BGA 27x27x22
- Brand:
- Fischer Elektronik
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Fischer Elektronik | |
| Product Type | Heatsink | |
| For Use With | Universal Square Alu | |
| Length | 27mm | |
| Width | 27mm | |
| Height | 22mm | |
| Thermal Resistance | 13.5K/W | |
| Fastening | Clamp, Conductive Adhesive, Glue, Integrated clamp, Screw, Thermally conductive adhesive | |
| Colour | Black | |
| Finish | Black Anodised | |
| Compatible Package Type | BGA | |
| Standards/Approvals | No | |
| Material | Aluminium | |
| Application | SMD, Heat Sink For IC, Bga, Fan, PLCC, Ic Processors, Power PC, Microprocessor, Cooler, PGA | |
| Select all | ||
|---|---|---|
Brand Fischer Elektronik | ||
Product Type Heatsink | ||
For Use With Universal Square Alu | ||
Length 27mm | ||
Width 27mm | ||
Height 22mm | ||
Thermal Resistance 13.5K/W | ||
Fastening Clamp, Conductive Adhesive, Glue, Integrated clamp, Screw, Thermally conductive adhesive | ||
Colour Black | ||
Finish Black Anodised | ||
Compatible Package Type BGA | ||
Standards/Approvals No | ||
Material Aluminium | ||
Application SMD, Heat Sink For IC, Bga, Fan, PLCC, Ic Processors, Power PC, Microprocessor, Cooler, PGA | ||
- COO (Country of Origin):
- DE
Fischer Elektronik ICK BGA Series Heatsink
ICK BGA series of heatsinks have been designed for use within IC processor heat dissipation. The series can be mounted via thermal adhesive orconductive foil (not included).
Features and Benefits
Black anodised surface.
Heatsink dimensions match respective BGA-type.
Can be affixed directly on to the BGA component with thermal adhesive or conductive foil (not included).
BGA Heatsinks
Related links
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