Transcend's M.2 2230 SSD MTE370T features state-of-the-art 3D NAND technology, which allows 112 layers of 3D
NAND flash chips to be vertically stacked. This density breakthrough greatly improves storage efficiency. The
MTE370T features the PCI Express (PCIe) Gen 3 x4 interface and is compatible with NVM Express (NVMe) 1.3
specifications to achieve never-before-seen transfer speeds. Applied with the 30μ" gold finger PCB and Corner Bond
technology, the MTE370T is fully tested in-house to guarantee reliability in mission-critical applications, boasting an
endurance rating of 3K Program/Erase cycles and an extended operating temperature ranging from -20℃∼75℃.

Compliant with RoHS 2.0 standards Compliant with NVM Express specification 1.3 Compliant with PCI Express specification 3.1 Space-saving M.2 form factor (30mm) – ideal for mobile computing devices Single-sided to fit perfectly in small form factor devices

Supports NVM command SLC caching technology Dynamic thermal throttling Built-in LDPC ECC (Error Correction Code) functionality Advanced Garbage Collection