Transcend MTE370T M.2 (2230) 512 GB Internal SSD
- RS Stock No.:
- 262-9750
- Mfr. Part No.:
- TS512GMTE370T
- Brand:
- Transcend
Subtotal (1 unit)*
£105.27
(exc. VAT)
£126.32
(inc. VAT)
FREE delivery for orders over £50.00
In Stock
- 11 unit(s) ready to ship
- Plus 1 unit(s) ready to ship from another location
- Plus 25 unit(s) shipping from 28 October 2025
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per unit |
---|---|
1 + | £105.27 |
*price indicative
- RS Stock No.:
- 262-9750
- Mfr. Part No.:
- TS512GMTE370T
- Brand:
- Transcend
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
---|---|---|
Brand | Transcend | |
Hard Drive Type | SSD | |
Model | MTE370T | |
Internal/External | Internal | |
Form Factor | M.2 (2230) | |
Industrial | Yes | |
Interface | NVMe PCIe Gen 3 x 4 | |
Capacity | 512 GB | |
Nand Type | 3D TLC | |
Select all | ||
---|---|---|
Brand Transcend | ||
Hard Drive Type SSD | ||
Model MTE370T | ||
Internal/External Internal | ||
Form Factor M.2 (2230) | ||
Industrial Yes | ||
Interface NVMe PCIe Gen 3 x 4 | ||
Capacity 512 GB | ||
Nand Type 3D TLC | ||
RoHS Status: Exempt
Transcend 512GB M.2 2230 PCIe gen3 x4 SSD - MTE370T
Transcend's M.2 2230 SSD MTE370T features state-of-the-art 3D NAND technology, which allows 112 layers of 3D
NAND flash chips to be vertically stacked. This density breakthrough greatly improves storage efficiency. The
MTE370T features the PCI Express (PCIe) Gen 3 x4 interface and is compatible with NVM Express (NVMe) 1.3
specifications to achieve never-before-seen transfer speeds. Applied with the 30μ" gold finger PCB and Corner Bond
technology, the MTE370T is fully tested in-house to guarantee reliability in mission-critical applications, boasting an
endurance rating of 3K Program/Erase cycles and an extended operating temperature ranging from -20℃∼75℃.
NAND flash chips to be vertically stacked. This density breakthrough greatly improves storage efficiency. The
MTE370T features the PCI Express (PCIe) Gen 3 x4 interface and is compatible with NVM Express (NVMe) 1.3
specifications to achieve never-before-seen transfer speeds. Applied with the 30μ" gold finger PCB and Corner Bond
technology, the MTE370T is fully tested in-house to guarantee reliability in mission-critical applications, boasting an
endurance rating of 3K Program/Erase cycles and an extended operating temperature ranging from -20℃∼75℃.
Hardware Features
Compliant with RoHS 2.0 standards Compliant with NVM Express specification 1.3 Compliant with PCI Express specification 3.1 Space-saving M.2 form factor (30mm) – ideal for mobile computing devices Single-sided to fit perfectly in small form factor devices
Firmware Features
Supports NVM command SLC caching technology Dynamic thermal throttling Built-in LDPC ECC (Error Correction Code) functionality Advanced Garbage Collection
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