Infineon 128 kB FRAM 8-Pin SOIC, FM24V01A-G
- RS Stock No.:
- 181-1595
- Mfr. Part No.:
- FM24V01A-G
- Brand:
- Infineon
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Units | Per unit | Per Pack* |
|---|---|---|
| 2 - 18 | £2.45 | £4.90 |
| 20 - 48 | £2.205 | £4.41 |
| 50 + | £1.96 | £3.92 |
*price indicative
- RS Stock No.:
- 181-1595
- Mfr. Part No.:
- FM24V01A-G
- Brand:
- Infineon
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Infineon | |
| Memory Size | 128kB | |
| Product Type | FRAM | |
| Organisation | 16kB x 8 Bit | |
| Data Bus Width | 8bit | |
| Maximum Random Access Time | 450ns | |
| Maximum Clock Frequency | 3.4MHz | |
| Mount Type | Surface | |
| Package Type | SOIC | |
| Pin Count | 8 | |
| Standards/Approvals | No | |
| Height | 1.38mm | |
| Width | 3.98mm | |
| Length | 4.97mm | |
| Maximum Operating Temperature | 85°C | |
| Number of Words | 16k | |
| Automotive Standard | AEC-Q100 | |
| Minimum Operating Temperature | -40°C | |
| Minimum Supply Voltage | 2V | |
| Maximum Supply Voltage | 3.6V | |
| Number of Bits per Word | 8 | |
| Select all | ||
|---|---|---|
Brand Infineon | ||
Memory Size 128kB | ||
Product Type FRAM | ||
Organisation 16kB x 8 Bit | ||
Data Bus Width 8bit | ||
Maximum Random Access Time 450ns | ||
Maximum Clock Frequency 3.4MHz | ||
Mount Type Surface | ||
Package Type SOIC | ||
Pin Count 8 | ||
Standards/Approvals No | ||
Height 1.38mm | ||
Width 3.98mm | ||
Length 4.97mm | ||
Maximum Operating Temperature 85°C | ||
Number of Words 16k | ||
Automotive Standard AEC-Q100 | ||
Minimum Operating Temperature -40°C | ||
Minimum Supply Voltage 2V | ||
Maximum Supply Voltage 3.6V | ||
Number of Bits per Word 8 | ||
Infineon FRAM, 128kB Memory Size, 3.6V Maximum Supply Voltage - FM24V01A-G
This FRAM is a non-volatile memory device designed for embedded systems requiring frequent writes and fast read access. It operates within a typical low-power digital environment and is suitable for applications where endurance and speed are needed alongside compact surface-mount packaging.
Features and Benefits:
• 128kB storage providing persistent data retention for frequent writes
• 8-bit data bus enabling straightforward parallel interfacing
• 450ns maximum random access time for rapid data retrieval
• 3.4MHz maximum clock frequency supporting moderate-speed serial transfers
• Operates from 2V to 3.6V enabling low-voltage system integration
• AEC-Q100 automotive qualification permitting use in vehicle electronics
• 8-bit data bus enabling straightforward parallel interfacing
• 450ns maximum random access time for rapid data retrieval
• 3.4MHz maximum clock frequency supporting moderate-speed serial transfers
• Operates from 2V to 3.6V enabling low-voltage system integration
• AEC-Q100 automotive qualification permitting use in vehicle electronics
Applications
• Suitable for data logging in automotive control modules
• Ideal for configuration storage in industrial control systems
• Used with battery-backed sensor nodes requiring frequent writes
• Can be used for parameter storage in motor control units
• Used for firmware scratchpad in system maintenance routines
• Ideal for configuration storage in industrial control systems
• Used with battery-backed sensor nodes requiring frequent writes
• Can be used for parameter storage in motor control units
• Used for firmware scratchpad in system maintenance routines
What package type should I plan for on my PCB?
It is supplied in an SOIC surface-mount package, with a compact rectangular footprint suited to automated assembly processes.
What temperature range can the device tolerate in deployed systems?
The component is rated to operate from -40°C up to 85°C, accommodating both cold-start and high-ambient industrial conditions.
How many addressable words are available for system allocation?
The memory organisation presents 16k words of 8 bits each, which supports byte-oriented storage schemes.
What physical mounting considerations apply for space-constrained designs?
The device is a low-profile surface-mount component with a small package height suitable for slim assemblies.
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