TE Connectivity 2.54mm Pitch Vertical 8 Way, Through Hole Turned Pin Open Frame IC Dip Socket, 3A
- RS Stock No.:
- 718-5155
- Mfr. Part No.:
- 808-AG10D
- Brand:
- TE Connectivity
Currently unavailable
We don’t know if this item will be back in stock, it is being discontinued by the manufacturer.
- RS Stock No.:
- 718-5155
- Mfr. Part No.:
- 808-AG10D
- Brand:
- TE Connectivity
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | TE Connectivity | |
| Number of Contacts | 8 | |
| Mounting Type | Through Hole | |
| Pin Type | Turned | |
| Pitch | 2.54mm | |
| Row Width | 7.62mm | |
| Frame Type | Open Frame | |
| Termination Method | Solder | |
| Contact Plating | Gold | |
| Current Rating | 3A | |
| Orientation | Vertical | |
| Length | 10.16mm | |
| Width | 10.16mm | |
| Depth | 2.67mm | |
| Dimensions | 10.16 x 10.16 x 2.67mm | |
| Contact Material | Beryllium Copper | |
| Minimum Operating Temperature | -55°C | |
| Housing Material | PET | |
| Maximum Operating Temperature | +105°C | |
Select all | ||
|---|---|---|
Brand TE Connectivity | ||
Number of Contacts 8 | ||
Mounting Type Through Hole | ||
Pin Type Turned | ||
Pitch 2.54mm | ||
Row Width 7.62mm | ||
Frame Type Open Frame | ||
Termination Method Solder | ||
Contact Plating Gold | ||
Current Rating 3A | ||
Orientation Vertical | ||
Length 10.16mm | ||
Width 10.16mm | ||
Depth 2.67mm | ||
Dimensions 10.16 x 10.16 x 2.67mm | ||
Contact Material Beryllium Copper | ||
Minimum Operating Temperature -55°C | ||
Housing Material PET | ||
Maximum Operating Temperature +105°C | ||
Standard, Gold Plated - TE Connectivity
These sockets have precision four-fingered inner contacts for high reliability.
Precision four-finger inner contact provides concentric funnel entry for easy flat and round lead insertion
"X" and "Y" Stackable
Low profile
Accommodates rectangular or round IC leads
Non-wicking, closed bottom sleeve gives 100% protection against flux and solder contamination
Recognized under the Component Program of Underwriters Laboratories, Inc. file No. E111362
Beryllium copper inner contact for maximum mechanical and electrical performance
"X" and "Y" Stackable
Low profile
Accommodates rectangular or round IC leads
Non-wicking, closed bottom sleeve gives 100% protection against flux and solder contamination
Recognized under the Component Program of Underwriters Laboratories, Inc. file No. E111362
Beryllium copper inner contact for maximum mechanical and electrical performance
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