TE Connectivity 2.54mm Pitch Vertical 32 Way, Through Hole Stamped Pin Closed Frame IC Dip Socket
- RS Stock No.:
- 719-8817
- Mfr. Part No.:
- 2-382189-1
- Brand:
- TE Connectivity
Currently unavailable
We don’t know if this item will be back in stock, it is being discontinued by the manufacturer.
- RS Stock No.:
- 719-8817
- Mfr. Part No.:
- 2-382189-1
- Brand:
- TE Connectivity
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | TE Connectivity | |
| Number of Contacts | 32 | |
| Mounting Type | Through Hole | |
| Pin Type | Stamped | |
| Pitch | 2.54mm | |
| Row Width | 15.24mm | |
| Frame Type | Closed Frame | |
| Termination Method | Solder | |
| Contact Plating | Tin | |
| Orientation | Vertical | |
| Length | 40.51mm | |
| Width | 5.33mm | |
| Depth | 17.63mm | |
| Dimensions | 40.51 x 5.33 x 17.63mm | |
| Contact Material | Beryllium Copper | |
| Housing Material | Thermoplastic | |
| Minimum Operating Temperature | -55°C | |
| Maximum Operating Temperature | +105°C | |
Select all | ||
|---|---|---|
Brand TE Connectivity | ||
Number of Contacts 32 | ||
Mounting Type Through Hole | ||
Pin Type Stamped | ||
Pitch 2.54mm | ||
Row Width 15.24mm | ||
Frame Type Closed Frame | ||
Termination Method Solder | ||
Contact Plating Tin | ||
Orientation Vertical | ||
Length 40.51mm | ||
Width 5.33mm | ||
Depth 17.63mm | ||
Dimensions 40.51 x 5.33 x 17.63mm | ||
Contact Material Beryllium Copper | ||
Housing Material Thermoplastic | ||
Minimum Operating Temperature -55°C | ||
Maximum Operating Temperature +105°C | ||
- COO (Country of Origin):
- US
TE Connectivity DIPLOMATE Dual Leaf PCB Mount DIP Socket
DIPLOMATE Dual Leaf (DL) DIP sockets with stamped and formed dual wiping contacts for vertical, through hole PCB mounting. These DIPLOMATE Dual Leaf (DL) DIP sockets have black thermoplastic GF stackable housings with a 2.54mm centreline, and a "true closed bottom" design which prevents solder or flux wicking and standoffs to allow board clearance for cleaning after soldering. The profiles for these DIPLOMATE Dual Leaf (DL) DIP sockets are all standard apart from part number 719-8817 which has an over-the-component profile. These DIPLOMATE DIP sockets are available with different frame styles with either straight or retention legs.
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