The new High Density D-Subminiature range is part of FCI’s I/O-Connections portfolio which provides customers access to a wide range of industry standard and application specific I/O interconnect solutions. FCI’s I/O connector solutions complete your board and system designs by providing high-density and high-speed interfaces to enable interconnect technologies for networking, storage and memory and complementary products for power distribution.

Compact-D is the answer to increasing need for higher density packaging
Contact layout 15 to 78 positions available
Selected layouts are also available in Press-fit & Pin-in-Paste version
Comes with different PCB mounting and panel mounting accessory options
RoHS compliant