Molex, 74060 2.00 mm Pitch PCB Connector, Vertical, 25 Column, 8 Row, 200 Way
- RS Stock No.:
- 795-623
- Mfr. Part No.:
- 74060-2502
- Brand:
- Molex
Subtotal (1 tube of 2 units)*
£257.88
(exc. VAT)
£309.46
(inc. VAT)
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- Shipping from 07 December 2026
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Tube(s) | Per Tube | Per unit* |
|---|---|---|
| 1 + | £257.88 | £128.94 |
*price indicative
- RS Stock No.:
- 795-623
- Mfr. Part No.:
- 74060-2502
- Brand:
- Molex
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Molex | |
| Product Type | Connector | |
| Backplane Connector Type | PCB | |
| Number of Contacts | 200 | |
| Current | 3.0A | |
| Number of Columns | 25 | |
| Orientation | Vertical | |
| Number of Rows | 8 | |
| Voltage | 120V ac/dc | |
| Housing Material | High Temperature Thermoplastic | |
| Pitch | 2.00mm | |
| Contact Material | Beryllium Copper | |
| Contact Plating | Gold | |
| Minimum Operating Temperature | -55°C | |
| Termination Type | Through Hole | |
| Maximum Operating Temperature | 105°C | |
| Standards/Approvals | UL | |
| Series | 74060 | |
| Select all | ||
|---|---|---|
Brand Molex | ||
Product Type Connector | ||
Backplane Connector Type PCB | ||
Number of Contacts 200 | ||
Current 3.0A | ||
Number of Columns 25 | ||
Orientation Vertical | ||
Number of Rows 8 | ||
Voltage 120V ac/dc | ||
Housing Material High Temperature Thermoplastic | ||
Pitch 2.00mm | ||
Contact Material Beryllium Copper | ||
Contact Plating Gold | ||
Minimum Operating Temperature -55°C | ||
Termination Type Through Hole | ||
Maximum Operating Temperature 105°C | ||
Standards/Approvals UL | ||
Series 74060 | ||
- COO (Country of Origin):
- CN
The Molex Board-to-Board Backplane Header offers a robust and versatile interconnection solution. Featuring a 2.00mm pitch design, it accommodates 200 circuits across 8 rows, ensuring reliable performance for backplane applications.
Supports a maximum current of 3.0A per contact for efficient power handling
Contains 200 circuits providing high-density interconnection options
Rated for data rates up to 3.125 Gbps, ensuring fast signal transmission
Constructed with high-temperature thermoplastic for enhanced durability
Utilises a ground plane shield for improved electrical performance
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