Molex, 171292 1.9 mm Pitch Connector Backplane Connector, Vertical, 6 Column, 9 Row, 54 Way

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Subtotal (1 tray of 30 units)*

£197.67

(exc. VAT)

£237.20

(inc. VAT)

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  • Ready to ship from 25 May 2026
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Tray(s)
Per Tray
Per unit*
1 +£197.67£6.589

*price indicative

RS Stock No.:
684-914
Mfr. Part No.:
171292-1328
Brand:
Molex
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Brand

Molex

Backplane Connector Type

Connector

Product Type

Backplane Connector

Number of Contacts

54

Current

0.75A

Number of Columns

6

Orientation

Vertical

Voltage

30V

Number of Rows

9

Pitch

1.9mm

Contact Plating

Gold over Tin

Termination Type

Solder

Minimum Operating Temperature

-55°C

Maximum Operating Temperature

85°C

Standards/Approvals

RoHS, REACH

Series

171292

COO (Country of Origin):
SG
The Molex Impact 100 Ohm 3 Pair Vertical Backplane Header is engineered for robust connectivity in high-performance applications. Designed with 54 circuits and arranged in six columns, it ensures reliable data transmission at a maximum data rate of 25.0 Gbps. This unguided header accommodates a pin length of 5.50mm and features high-quality plating with matte tin and gold, enhancing durability and electrical performance. The component is compliant with various environmental regulations, making it a reliable choice for modern electronic assemblies, while its vertical orientation simplifies integration into space-constrained designs. With a wide operating temperature range from -55°C to +85°C, this product is adept at handling diverse operating conditions.

Active status ensures up to date usability

Designed for conventional applications, facilitating ease of use

High performance alloy construction guarantees durability and reliability

Features a black resin colour for aesthetic and functional benefits

Capable of 200 mating cycles to withstand frequent connections

Terminated through hole style supports various PCB designs

Compatible with GbX Backplane Guide Pins for optimal alignment

Low halogen compliance promotes safer environmental practices

Effective for high speed data transfer and connections in critical applications

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