Rubycon 2200μF Aluminium Electrolytic Capacitor 16V dc, Radial, Through Hole - 16YXF2200M12.5X25
- RS Stock No.:
- 224-4224
- Mfr. Part No.:
- 16YXF2200M12.5X25
- Brand:
- Rubycon
Bulk discount available
Subtotal (1 pack of 5 units)*
£4.33
(exc. VAT)
£5.195
(inc. VAT)
FREE delivery for orders over £50.00
Last RS stock
- 60 left, ready to ship
- Plus 205 left, ready to ship from another location
- Final 200 unit(s) shipping from 10 October 2025
Units | Per unit | Per Pack* |
---|---|---|
5 - 45 | £0.866 | £4.33 |
50 - 95 | £0.814 | £4.07 |
100 - 245 | £0.758 | £3.79 |
250 - 495 | £0.71 | £3.55 |
500 + | £0.642 | £3.21 |
*price indicative
Alternative
This product is not currently available. Here is our alternative recommendation.
Each (In a Box of 300)
£0.725
(exc. VAT)
£0.87
(inc. VAT)
- RS Stock No.:
- 224-4224
- Mfr. Part No.:
- 16YXF2200M12.5X25
- Brand:
- Rubycon
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
---|---|---|
Brand | Rubycon | |
Capacitance | 2200µF | |
Voltage | 16V dc | |
Mounting Type | Radial, Through Hole | |
Technology | Aluminium Electrolytic | |
Dimensions | 12.5 (Dia.) x 25mm | |
Height | 25mm | |
Minimum Operating Temperature | -40°C | |
Diameter | 12.5mm | |
Maximum Operating Temperature | +105°C | |
Lead Pitch | 5mm | |
Lifetime | 10000h | |
Leakage Current | 3 μA | |
Series | YXF | |
Ripple Current | 1.65A | |
Tolerance | ±20% | |
Select all | ||
---|---|---|
Brand Rubycon | ||
Capacitance 2200µF | ||
Voltage 16V dc | ||
Mounting Type Radial, Through Hole | ||
Technology Aluminium Electrolytic | ||
Dimensions 12.5 (Dia.) x 25mm | ||
Height 25mm | ||
Minimum Operating Temperature -40°C | ||
Diameter 12.5mm | ||
Maximum Operating Temperature +105°C | ||
Lead Pitch 5mm | ||
Lifetime 10000h | ||
Leakage Current 3 μA | ||
Series YXF | ||
Ripple Current 1.65A | ||
Tolerance ±20% | ||
YXF Series
Miniature high temperature radial wire ended electrolytic capacitors for use in applications where board space is at a premium.
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