onsemi SM05T1G, Dual-Element Uni-Directional TVS Diode, 300W, 3-Pin SOT-23

Save 25% when you buy 1000 units

Subtotal (1 pack of 100 units)*

£6.70

(exc. VAT)

£8.00

(inc. VAT)

Add to Basket
Select or type quantity
In Stock
  • 5,400 unit(s) ready to ship
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units
Per unit
Per Pack*
100 - 400£0.067£6.70
500 - 900£0.058£5.80
1000 +£0.05£5.00

*price indicative

Packaging Options:
RS Stock No.:
184-1447
Mfr. Part No.:
SM05T1G
Brand:
onsemi
Find similar products by selecting one or more attributes.
Select all

Brand

onsemi

Diode Configuration

Common Anode

Direction Type

Uni-Directional

Maximum Clamping Voltage

9.8V

Minimum Breakdown Voltage

6.2V

Mounting Type

Surface Mount

Package Type

SOT-23

Pin Count

3

Peak Pulse Power Dissipation

300W

Maximum Peak Pulse Current

17A

ESD Protection

Yes

Number of Elements per Chip

2

Minimum Operating Temperature

-55 °C

Dimensions

3.04 x 1.4 x 1.01mm

Maximum Operating Temperature

+150 °C

Test Current

1mA

Width

1.4mm

Height

1.01mm

Automotive Standard

AEC-Q101

Working Voltage

5V

Capacitance

225pF

Length

3.04mm

Maximum Reverse Leakage Current

10µA

COO (Country of Origin):
CN
These dual monolithic silicon diodes are designed for applications requiring protection capability. They are intended for use in voltage and ESD sensitive equipment such as computers, printers, business machines, communication systems, medical equipment and other applications. Their dual junction common anode design protects two separate lines using only one package. These devices are ideal for situations where board space is at a premium.

SOT–23 Package Allows Either Two Separate Unidirectional Configurations or a Single Bidirectional Configuration
Working Peak Reverse Voltage 5 V
Standard Zener Breakdown Voltage Range 6.2 V to 7.3 V
Peak Power – 300 Watt (8 X 20 μs)
Low Leakage
Mechanical Characteristics:
CASE: Void-free, transfer-molded, thermosetting plastic case
FINISH: Corrosion resistant finish, easily solderable
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260 °C for 10 Seconds
Package designed for optimal automated board assembly
Small package size for high density applications. Available in 8 mm Tape and Reel.

Related links