Nexperia PESD2USB30Z, Dual-Element ESD Protection Diode, 10-Pin WLCSP
- RS Stock No.:
- 153-1918
- Mfr. Part No.:
- PESD2USB30Z
- Brand:
- Nexperia
Stock information currently inaccessible
- RS Stock No.:
- 153-1918
- Mfr. Part No.:
- PESD2USB30Z
- Brand:
- Nexperia
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Nexperia | |
| Minimum Breakdown Voltage | 6V | |
| Mounting Type | Surface Mount | |
| Package Type | WLCSP | |
| Pin Count | 10 | |
| Maximum Peak Pulse Current | 8A | |
| ESD Protection | Yes | |
| Number of Elements per Chip | 2 | |
| Minimum Operating Temperature | -40 °C | |
| Maximum Operating Temperature | +85 °C | |
| Dimensions | 1.62 x 1.22 x 0.38mm | |
| Working Voltage | 5V | |
| Length | 1.62mm | |
| Maximum Reverse Leakage Current | 100nA | |
| Height | 0.38mm | |
| Width | 1.22mm | |
| Capacitance | 0.45pF | |
| Select all | ||
|---|---|---|
Brand Nexperia | ||
Minimum Breakdown Voltage 6V | ||
Mounting Type Surface Mount | ||
Package Type WLCSP | ||
Pin Count 10 | ||
Maximum Peak Pulse Current 8A | ||
ESD Protection Yes | ||
Number of Elements per Chip 2 | ||
Minimum Operating Temperature -40 °C | ||
Maximum Operating Temperature +85 °C | ||
Dimensions 1.62 x 1.22 x 0.38mm | ||
Working Voltage 5V | ||
Length 1.62mm | ||
Maximum Reverse Leakage Current 100nA | ||
Height 0.38mm | ||
Width 1.22mm | ||
Capacitance 0.45pF | ||
ESD protection for differential data lines, PESD2USB30 is an ElectroStatic Discharge (ESD) protection device for two differential channels. It is footprint compatible to PCMF2USB30 common mode filters with ESD protection. The diodes provide protection to downstream components from ESD voltages up to +/- 15 kV on each signal line.
The diodes provide protection to downstream components from ESD voltages up to +/- 15 kV on each signal line.
TrEOS process for very high system-level ESD robustness: superior protection of sensitive Systems on Chips (SoCs).
Industry-standard Wafer-Level Chip Scale package (WLCSP10).
Smartphone, cellular and cordless phone
Tablet PC and Mobile Internet Device (MID)
USB3.1, USB2.0, HDMI2.0, HDMI1.4
MIPI D-PHY as used in Camera Serial Interface (CSI) and Display Serial Interface (DSI)
General-purpose downstream ESD protection for differential data lines
TrEOS process for very high system-level ESD robustness: superior protection of sensitive Systems on Chips (SoCs).
Industry-standard Wafer-Level Chip Scale package (WLCSP10).
Smartphone, cellular and cordless phone
Tablet PC and Mobile Internet Device (MID)
USB3.1, USB2.0, HDMI2.0, HDMI1.4
MIPI D-PHY as used in Camera Serial Interface (CSI) and Display Serial Interface (DSI)
General-purpose downstream ESD protection for differential data lines