Nexperia PUSB3FR6Z, Hex-Element ESD Protection Diode, 7-Pin DFN2111
- RS Stock No.:
- 151-3163
- Mfr. Part No.:
- PUSB3FR6Z
- Brand:
- Nexperia
Unavailable
RS will no longer stock this product.
- RS Stock No.:
- 151-3163
- Mfr. Part No.:
- PUSB3FR6Z
- Brand:
- Nexperia
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Nexperia | |
| Maximum Clamping Voltage | 3V | |
| Minimum Breakdown Voltage | 6V | |
| Mounting Type | Surface Mount | |
| Package Type | DFN2111 | |
| Pin Count | 7 | |
| Maximum Peak Pulse Current | 7A | |
| ESD Protection | Yes | |
| Number of Elements per Chip | 6 | |
| Minimum Operating Temperature | -40 °C | |
| Maximum Operating Temperature | +85 °C | |
| Dimensions | 2.2 x 1.2 x 0.45mm | |
| Length | 2.2mm | |
| Working Voltage | 3.3V | |
| Capacitance | 0.4pF | |
| Maximum Reverse Leakage Current | 100nA | |
| Height | 0.45mm | |
| Width | 1.2mm | |
| Select all | ||
|---|---|---|
Brand Nexperia | ||
Maximum Clamping Voltage 3V | ||
Minimum Breakdown Voltage 6V | ||
Mounting Type Surface Mount | ||
Package Type DFN2111 | ||
Pin Count 7 | ||
Maximum Peak Pulse Current 7A | ||
ESD Protection Yes | ||
Number of Elements per Chip 6 | ||
Minimum Operating Temperature -40 °C | ||
Maximum Operating Temperature +85 °C | ||
Dimensions 2.2 x 1.2 x 0.45mm | ||
Length 2.2mm | ||
Working Voltage 3.3V | ||
Capacitance 0.4pF | ||
Maximum Reverse Leakage Current 100nA | ||
Height 0.45mm | ||
Width 1.2mm | ||
ESD protection for ultra high-speed interfaces, The device is designed to protect high-speed interfaces such as Super Speed and Hi-Speed USB combination, SD-memory card 3.0 and thunderbolt interfaces against Electro Static Discharge (ESD). The device includes six high-level ESD protection diode structures for ultra high-speed signal lines. The device is encapsulated in a leadless ultra small DFN2111-7 (SOT1358-1) Surface-Mounted Device (SMD) plastic package.
Supports SuperSpeed USB 3.1 at 10 Gbps
All signal lines with integrated rail-to-rail clamping diodes for downstream ESD protection
Matched 0.5 mm trace spacing
Line capacitance of only 0.35 pF for each channel
Design-friendly ’pass-through’ signal routing
All signal lines with integrated rail-to-rail clamping diodes for downstream ESD protection
Matched 0.5 mm trace spacing
Line capacitance of only 0.35 pF for each channel
Design-friendly ’pass-through’ signal routing