The gap pad is a highly conformable and thermally conductive material designed for low-stress applications that require excellent heat transfer. With a thermal conductivity of 2.4 W/m-K, this reinforced 'S-Class' material is ideal for use between processors and heat sinks, graphics chips and heat sinks, and in DVD and CDROM electronics cooling. Its ultra conformable and gel-like modulus makes it easy to handle and provides added tear resistance. The Gap Pad 2500S20 is well-suited for low-pressure applications that use fixed standoff or clip mounting.

Thermal conductivity of 2.4 W/m-K for efficient heat transfer
Reinforced with fiberglass for added tear resistance
Ultra-conformable and gel-like modulus for easy handling
Designed for low-stress applications
Inherent surface tack on both sides for stick-in-place characteristics during assembly