RND RND 460 Series Thermal Gap Pad, 2mm Thick, 5W/m·K, Silicone, 100 x 100 x 2mm
- RS Stock No.:
- 492-655
- Mfr. Part No.:
- RND 460-00134
- Brand:
- RND
Unavailable
RS will no longer stock this product.
- RS Stock No.:
- 492-655
- Mfr. Part No.:
- RND 460-00134
- Brand:
- RND
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
---|---|---|
Brand | RND | |
Dimensions | 100 x 100 x 2mm | |
Thickness | 2mm | |
Length | 100mm | |
Width | 100mm | |
Thermal Conductivity | 5W/m·K | |
Material | Silicone | |
Series | RND 460 | |
Select all | ||
---|---|---|
Brand RND | ||
Dimensions 100 x 100 x 2mm | ||
Thickness 2mm | ||
Length 100mm | ||
Width 100mm | ||
Thermal Conductivity 5W/m·K | ||
Material Silicone | ||
Series RND 460 | ||
- COO (Country of Origin):
- CN
The RND Thermal Gap Pad is an innovative solution designed to enhance heat dissipation in electronic applications. With its unique silicone composition, this pad not only offers flexibility and compressibility but also excels in providing high thermal conductivity. It is ideal for filling gaps between electronic devices and heat sinks, ensuring an effective thermal interface even in the most demanding environments. Boasting exceptional resistance to temperature variations and environmental factors, this product aids in optimising performance while prolonging the lifespan of critical components. The pad is double-sided and slightly sticky, making installation straightforward and reliable, perfect for various applications where reliability is paramount.
Self-adhesive design simplifies the installation process for users
Environmentally friendly material contributes to a sustainable choice
Meets high compression capacity without compromising effectiveness
Perfect for electronic devices that require enhanced thermal management
Environmentally friendly material contributes to a sustainable choice
Meets high compression capacity without compromising effectiveness
Perfect for electronic devices that require enhanced thermal management
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