T-flex™ 300 is a silicone gel combined with a ceramic powder to offer a unique combination of compliancy, thermal resistance and price. At pressures of 50 psi, it deflects over 50% the original thickness. This high rate of compliancy allows the material to “totally blanket” the component, enhancing thermal transfer. The material has a very low compression set, enabling the pad to be reused many times. Low thermal resistances can be achieved at low pressures.

Exceptional compliancy
Square package outline
Thermal conductivity 1.1 W/mK
Breakdown voltage > 10,000 Vac
Operating temperature -40 → 160°C