This thermal grease adhesive provides an excellent heat transfer between semiconductor devices and heat sinks. It is based on a silicone oil and therefore offers a wide operating temperature range and excellent stability at high temperatures.
Improves electrical isolation when used in the normal way with insulating washers and reduce time lag in thermostats.
This heat sink compound is recommended where the efficient and reliable thermal coupling of electrical and electronic components is required, or between any surface where thermal conductivity or heat dissipation is important.

Wide operating temperature range
Excellent thermal conductivity even at high temperatures
Low in toxicity
White colour enables treated parts to be easily identified
Low evaporation weight loss
Chemically inert (not chemically reactive)
Shock absorbent
Moisture repellent with long-term stability

It should be applied to the base and mounting studs of diodes, transistors, thyristors, heat sinks, silicone rectifiers and semi-conductors, thermostats, power resistors and radiators.

Both 554-311 and 503-357 (Non-Silicon Heat Transfer Compound) are metal filled pastes combining the properties of high thermal conductivity and high insulation resistance. One compound contains a silicone base while the other relies on synthetic fluids, reducing any contamination risk.