Wurth Elektronik, WE-CBF, 0603 Shielded Multilayer Surface Mount Inductor with a Ferrite Core, Multilayer 200 mA Idc

Subtotal (1 reel of 4000 units)*

£472.00

(exc. VAT)

£568.00

(inc. VAT)

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4000 +£0.118£472.00

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RS Stock No.:
144-9794
Mfr. Part No.:
74279266
Brand:
Wurth Elektronik
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Brand

Wurth Elektronik

Product Type

Multilayer Surface Mount Inductor

Maximum DC Current

200mA

Package/Case

0603

Packaging

Tape & Reel

Length

1.6mm

Automotive Standard

No

Shielding

Yes

Maximum DC Resistance

600mΩ

Pin Count

2

Minimum Operating Temperature

-55°C

Maximum Operating Temperature

125°C

Series

WE-CBF

Depth

800μm

Height

800μm

Core Material

Ferrite

Termination Style

Surface Mount

Standards/Approvals

IEC 60286-3:2013

Inductor Construction

Multilayer

Moulded

Yes

COO (Country of Origin):
TW

Wurth Elektronik WE-CBF Series Multilayer Surface Mount Inductor, 200mA Maximum DC Current, 600mΩ Maximum DC Resistance - 74279266


This multilayer surface-mount inductor provides low-current magnetic filtering in Compact SMD assemblies and operates across a wide temperature range. It is a moulded, shielded ferrite component designed for placement on printed circuit boards using tape-and-reel packaging, suitable for applications requiring a small footprint and stable performance under thermal stress.

Features and Benefits:


• Up to 200mA current rating enables low-current signal filtering
• 600mΩ RDC limits voltage drop in low-power circuits
• Shielded construction reduces electromagnetic interference
• Ferrite core material improves inductance stability with temperature
• Tape-and-reel packaging supports automated placement

Applications


• Suitable for power‑line noise suppression in control modules
• Ideal for signal conditioning in Compact consumer electronics
• Used with precision analogue front‑ends requiring low leakage
• Can be used for EMI mitigation in communication interfaces

What mounting style does it use?


It is offered with surface-mount terminations for SMD assembly.

What package size should be planned for footprint design?


The component uses an 0603 package case intended for Compact board layouts.

How does it behave across temperature extremes?


It is specified to function between -55°C and 125°C for broad thermal operation.

Is the component moulded or an open construction?


The device is moulded and incorporates shielding for mechanical protection and EMI control.

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