Infineon 650V 12A, Rectifier & Schottky Diode, PG-VSON-4 IDL12G65C5XUMA2
- RS Stock No.:
- 258-0971P
- Mfr. Part No.:
- IDL12G65C5XUMA2
- Brand:
- Infineon
Bulk discount available
Subtotal 10 units (supplied on a continuous strip)*
£25.80
(exc. VAT)
£31.00
(inc. VAT)
FREE delivery for orders over £50.00
In Stock
- 3,000 unit(s) ready to ship
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per unit |
|---|---|
| 10 - 24 | £2.58 |
| 25 - 49 | £2.41 |
| 50 - 99 | £2.24 |
| 100 + | £2.10 |
*price indicative
- RS Stock No.:
- 258-0971P
- Mfr. Part No.:
- IDL12G65C5XUMA2
- Brand:
- Infineon
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Infineon | |
| Mounting Type | Surface Mount | |
| Package Type | PG-VSON-4 | |
| Maximum Continuous Forward Current | 12A | |
| Peak Reverse Repetitive Voltage | 650V | |
| Series | IDL12G65C5 | |
Select all | ||
|---|---|---|
Brand Infineon | ||
Mounting Type Surface Mount | ||
Package Type PG-VSON-4 | ||
Maximum Continuous Forward Current 12A | ||
Peak Reverse Repetitive Voltage 650V | ||
Series IDL12G65C5 | ||
The Infineon CoolSiC Schottky diodes generation 5 600V, 2 A in a DPAK real2pin package represents our leading edge technology for SiC Schottky barrier diodes. The Infineon proprietary diffusion soldering process, already introduced with G3, is now combined with a new, more compact design and thin wafer technology. The result is a new family of products showing improved efficiency over all load conditions, coming from both the improved thermal characteristics and a lower figure of merit.
No reverse recovery charge
Soft switching reverse recovery waveform
Temperature independent switching behaviour
Highly stable switching performance
Reduced cooling requirements
Reduced risks of thermal runaway
Soft switching reverse recovery waveform
Temperature independent switching behaviour
Highly stable switching performance
Reduced cooling requirements
Reduced risks of thermal runaway
