onsemi 10V 1A, Schottky Diode, 5-Pin CASE 457-04 MBRM110ET1G
- RS Stock No.:
- 186-7713
- Mfr. Part No.:
- MBRM110ET1G
- Brand:
- onsemi
Bulk discount available
Subtotal (1 pack of 25 units)*
£3.10
(exc. VAT)
£3.725
(inc. VAT)
Stock information currently inaccessible
Units | Per unit | Per Pack* |
|---|---|---|
| 25 - 75 | £0.124 | £3.10 |
| 100 - 225 | £0.107 | £2.68 |
| 250 - 475 | £0.093 | £2.33 |
| 500 - 975 | £0.082 | £2.05 |
| 1000 + | £0.074 | £1.85 |
*price indicative
- RS Stock No.:
- 186-7713
- Mfr. Part No.:
- MBRM110ET1G
- Brand:
- onsemi
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | onsemi | |
| Mounting Type | Surface Mount | |
| Package Type | CASE 457-04 | |
| Maximum Continuous Forward Current | 1A | |
| Peak Reverse Repetitive Voltage | 10V | |
| Diode Configuration | Single | |
| Rectifier Type | Schottky Rectifier | |
| Diode Type | Schottky | |
| Pin Count | 5 | |
| Number of Elements per Chip | 1 | |
| Diode Technology | Schottky Barrier | |
| Peak Non-Repetitive Forward Surge Current | 50A | |
| Select all | ||
|---|---|---|
Brand onsemi | ||
Mounting Type Surface Mount | ||
Package Type CASE 457-04 | ||
Maximum Continuous Forward Current 1A | ||
Peak Reverse Repetitive Voltage 10V | ||
Diode Configuration Single | ||
Rectifier Type Schottky Rectifier | ||
Diode Type Schottky | ||
Pin Count 5 | ||
Number of Elements per Chip 1 | ||
Diode Technology Schottky Barrier | ||
Peak Non-Repetitive Forward Surge Current 50A | ||
Low IR Extends Battery Life
Low Profile - Maximum Height of 1.1 mm
Small Footprint - Footprint Area of 8.45 mm2
150°C Operating Junction Temperature
Low Thermal Resistance with Direct Thermal Path of Die on Exposed Cathode Heat Sink
Mechanical Characteristics:
Case: Molded Epoxy
Weight: 62 mg (approximately)
Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Maximum for 10 Seconds
Pb-Free Packages are Available
PPAP capable
NRVB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements
Low Profile - Maximum Height of 1.1 mm
Small Footprint - Footprint Area of 8.45 mm2
150°C Operating Junction Temperature
Low Thermal Resistance with Direct Thermal Path of Die on Exposed Cathode Heat Sink
Mechanical Characteristics:
Case: Molded Epoxy
Weight: 62 mg (approximately)
Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Maximum for 10 Seconds
Pb-Free Packages are Available
PPAP capable
NRVB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements
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