CTS, 74X 220Ω ±5% Array Resistor, 0.1W total, 0805 (2012M), Solder
- RS Stock No.:
- 179-0268
- Mfr. Part No.:
- 743C083221JP
- Brand:
- CTS
Unavailable
RS will no longer stock this product.
- RS Stock No.:
- 179-0268
- Mfr. Part No.:
- 743C083221JP
- Brand:
- CTS
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | CTS | |
| Resistance | 220Ω | |
| Package/Case | 0805 (2012M) | |
| Power Rating | 0.1W | |
| Termination Style | Solder | |
| Tolerance | ±5% | |
| Series | 74X | |
| Maximum Operating Temperature | +125°C | |
| Temperature Coefficient | ±200ppm/°C | |
| Minimum Operating Temperature | -55°C | |
| Select all | ||
|---|---|---|
Brand CTS | ||
Resistance 220Ω | ||
Package/Case 0805 (2012M) | ||
Power Rating 0.1W | ||
Termination Style Solder | ||
Tolerance ±5% | ||
Series 74X | ||
Maximum Operating Temperature +125°C | ||
Temperature Coefficient ±200ppm/°C | ||
Minimum Operating Temperature -55°C | ||
74x Series Chip Arrays are single packaged devices containing an array of homogeneous resistor elements. Arrays are typically used for convenience when several resistors occupy the same area in a layout. Multiple package sizes and circuit configurations help save placement costs by reducing application component count.
Low Cost Thick Film Technology
Leadless Surface Mount Construction
Concave or Convex Terminations
Solder Coated Nickel Barrier Pads
Isolated and Bussed Circuit Configurations
Improved TCR Tracking vs. Discrete Resistors
Fewer Placements Than Discrete Components
Tape and Reel Packaging
Applications:
Data Communications
Image Processing
Medical Equipment
Networking
Pull-Up/Pull-Down Logic Gates
DDR SDRAM, MDDR, DRAM
Portable Test Equipment
Low Profile High Density Designs
Leadless Surface Mount Construction
Concave or Convex Terminations
Solder Coated Nickel Barrier Pads
Isolated and Bussed Circuit Configurations
Improved TCR Tracking vs. Discrete Resistors
Fewer Placements Than Discrete Components
Tape and Reel Packaging
Applications:
Data Communications
Image Processing
Medical Equipment
Networking
Pull-Up/Pull-Down Logic Gates
DDR SDRAM, MDDR, DRAM
Portable Test Equipment
Low Profile High Density Designs