The CIF Athelec FT03 batch reflow oven is compatible with high-temperature alloys and above all, lead- free ones because of its new heating system as well as electronics. This reflow oven has been conceived to the reflow of solder paste and polymerization of the glues for prototyping. It includes 10 program memorization, information display on the LCD monitor and a viewing window to supervise the process.

View of the card because of a large window on the front panel
Compact model with a working area of 190mm x 290mm
Heating through forced convection
Quartz heating elements of 2 x 1KW
Temperature control by a microprocessor, maximum 300°C
Easy programming for immediate control
Safety: double window with air circulation, closing door access