onsemi PowerTrench P-Channel MOSFET, 2.9 A, 30 V, 6-Pin MLP FDMA1430JP
- RS Stock No.:
- 806-3475
- Mfr. Part No.:
- FDMA1430JP
- Brand:
- ON Semiconductor
- RS Stock No.:
- 806-3475
- Mfr. Part No.:
- FDMA1430JP
- Brand:
- ON Semiconductor
Select all | Attribute | Value |
|---|---|---|
| Brand | ON Semiconductor | |
| Channel Type | P | |
| Maximum Continuous Drain Current | 2.9 A | |
| Maximum Drain Source Voltage | 30 V | |
| Package Type | MLP | |
| Series | PowerTrench | |
| Mounting Type | Surface Mount | |
| Pin Count | 6 | |
| Maximum Drain Source Resistance | 240 mΩ | |
| Channel Mode | Enhancement | |
| Maximum Gate Threshold Voltage | 1V | |
| Minimum Gate Threshold Voltage | 0.4V | |
| Maximum Power Dissipation | 1.5 W | |
| Transistor Configuration | Single | |
| Maximum Gate Source Voltage | -8 V, +8 V | |
| Number of Elements per Chip | 1 | |
| Transistor Material | Si | |
| Length | 2mm | |
| Maximum Operating Temperature | +150 °C | |
| Typical Gate Charge @ Vgs | 7.2 nC @ 4.5 V | |
| Width | 2mm | |
| Height | 0.725mm | |
| Minimum Operating Temperature | -55 °C | |
| Forward Diode Voltage | 1.2V | |
| Select all | ||
|---|---|---|
Brand ON Semiconductor | ||
Channel Type P | ||
Maximum Continuous Drain Current 2.9 A | ||
Maximum Drain Source Voltage 30 V | ||
Package Type MLP | ||
Series PowerTrench | ||
Mounting Type Surface Mount | ||
Pin Count 6 | ||
Maximum Drain Source Resistance 240 mΩ | ||
Channel Mode Enhancement | ||
Maximum Gate Threshold Voltage 1V | ||
Minimum Gate Threshold Voltage 0.4V | ||
Maximum Power Dissipation 1.5 W | ||
Transistor Configuration Single | ||
Maximum Gate Source Voltage -8 V, +8 V | ||
Number of Elements per Chip 1 | ||
Transistor Material Si | ||
Length 2mm | ||
Maximum Operating Temperature +150 °C | ||
Typical Gate Charge @ Vgs 7.2 nC @ 4.5 V | ||
Width 2mm | ||
Height 0.725mm | ||
Minimum Operating Temperature -55 °C | ||
Forward Diode Voltage 1.2V | ||
P-Channel PowerTrench® MOSFET, and NPN Bipolar Transistor, Fairchild Semiconductor
ON Semi MOSFETs provide superior design reliability from reduced voltage spikes and overshoot, to lower junction capacitance and reverse recovery charge, to elimination of additional external components to keep systems up and running longer.
