Samtec SEAF Series Straight Surface Mount PCB Socket, 320-Contact, 8-Row, 1.27mm Pitch, Solder Termination
- RS Stock No.:
- 767-8988
- Mfr. Part No.:
- SEAF-40-06.5-S-08-2-A-K-TR
- Brand:
- Samtec
Currently unavailable
We don’t know if this item will be back in stock, it is being discontinued by the manufacturer.
- RS Stock No.:
- 767-8988
- Mfr. Part No.:
- SEAF-40-06.5-S-08-2-A-K-TR
- Brand:
- Samtec
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
---|---|---|
Brand | Samtec | |
Number of Contacts | 320 | |
Number of Rows | 8 | |
Pitch | 1.27mm | |
Type | Board to Board | |
Mounting Type | Surface Mount | |
Body Orientation | Straight | |
Termination Method | Solder | |
Current Rating | 2.3A | |
Voltage Rating | 240 V ac | |
Series | SEAF | |
Contact Material | Copper Alloy | |
Select all | ||
---|---|---|
Brand Samtec | ||
Number of Contacts 320 | ||
Number of Rows 8 | ||
Pitch 1.27mm | ||
Type Board to Board | ||
Mounting Type Surface Mount | ||
Body Orientation Straight | ||
Termination Method Solder | ||
Current Rating 2.3A | ||
Voltage Rating 240 V ac | ||
Series SEAF | ||
Contact Material Copper Alloy | ||
1.27mm SEARAY™ Series Interconnects
SEARAY™ is a 1.27mm high density, high speed board-to-board interconnect system. These SEAM / SEAF Series connectors can be mapped as a single-ended application, differential pair application, or a combination of both. When routed as a single-ended system, SEARAY™ is rated at 12.5 GHz @ -3dB. The SEAM / SEAF Series of High Speed / High Density Open Pin Field Array employs Solder Charge Technology for improved solder joint reliability. These SEAM SEAF Series SEARAY™ High Speed / High Density Open Pin Field Array use the Samtec Edge Rate contact system which gives high speed performance, zippering when mating and unmating as well as lowering insertion and extraction forces.
Various rows high density connectors suitable for board stacking applications
Stack height dependant upon SEAF/SEAM combination from 7 mm
Contact resistance: 5.5 mΩ
Contact Plating: 0.76 μm Gold on contact area with Matte Tin on tail area
Stack height dependant upon SEAF/SEAM combination from 7 mm
Contact resistance: 5.5 mΩ
Contact Plating: 0.76 μm Gold on contact area with Matte Tin on tail area